Invention Grant
- Patent Title: Fabrication of thin film fin transistor structure
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Application No.: US17129867Application Date: 2020-12-21
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Publication No.: US12080781B2Publication Date: 2024-09-03
- Inventor: Noriyuki Sato , Sarah Atanasov , Abhishek A. Sharma , Bernhard Sell , Chieh-Jen Ku , Elliot N. Tan , Hui Jae Yoo , Travis W. Lajoie , Van H. Le , Pei-Hua Wang , Jason Peck , Tobias Brown-Heft
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L27/092

Abstract:
Thin film transistors fabricated using a spacer as a fin are described. In an example, a method of forming a fin transistor structure includes patterning a plurality of backbone pillars on a semiconductor substrate. The method may then include conformally depositing a spacer layer over the plurality of backbone pillars and the semiconductor substrate. A spacer etch of the spacer layer is then performed to leave a sidewall of the spacer layer on a backbone pillar to form a fin of the fin transistor structure. Other embodiments may be described and claimed.
Public/Granted literature
- US20220199807A1 FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE Public/Granted day:2022-06-23
Information query
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