- 专利标题: Semiconductor devices and method of fabricating the same
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申请号: US18307279申请日: 2023-04-26
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公开(公告)号: US12094974B2公开(公告)日: 2024-09-17
- 发明人: Jaemun Kim , Dahye Kim , Jinbum Kim , Gyeom Kim , Dohee Kim , Dongwoo Kim , Seunghun Lee
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR 20200082374 2020.07.03
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/8234 ; H01L29/417 ; H01L29/66 ; H01L29/04
摘要:
A semiconductor device includes a substrate including a fin-type active region, the fin-type active region extending in a first direction; a plurality of channel layers on the fin-type active region, the plurality of channel layers including an uppermost channel layer, a lowermost channel layer, and an intermediate channel layer isolated from direct contact with each other in a direction perpendicular to an upper surface of the substrate; a gate electrode surrounding the plurality of channel layers and extending in a second direction intersecting the first direction; a gate insulating film between the plurality of channel layers and the gate electrode; and source/drain regions electrically connected to the plurality of channel layers. In a cross section taken in the second direction, the uppermost channel layer has a width greater than a width of the intermediate channel layer.
公开/授权文献
- US20230268441A1 SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME 公开/授权日:2023-08-24
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