INTEGRATED CIRCUIT DEVICES INCLUDING VERTICALLY STACKED FIELD EFFECT TRANSISTORS

    公开(公告)号:US20230076270A1

    公开(公告)日:2023-03-09

    申请号:US17720880

    申请日:2022-04-14

    摘要: An integrated circuit device includes: an active region extending in a first horizontal direction on a substrate; a first transistor at a first vertical level on the active region, the first transistor including a first source/drain region having a first conductive type; and a second transistor at a second vertical level that is higher than the first vertical level on the active region, the second transistor including a second source/drain region having a second conductive type and overlapping the first source/drain region in a vertical direction, wherein the first source/drain region and the second source/drain region have different sizes.

    Integrated circuit device
    5.
    发明授权

    公开(公告)号:US12113108B2

    公开(公告)日:2024-10-08

    申请号:US17472926

    申请日:2021-09-13

    CPC分类号: H01L29/41775 H01L27/0886

    摘要: An integrated circuit device includes a plurality of gate structures each including a gate line extending on a fin-type active region and insulation spacers on sidewalls of the gate line; a source/drain contact between first and second gate structures, and having opposing sides that are asymmetric in the first horizontal direction; and an insulation liner on sidewalls of the source/drain contact. The source/drain contact includes a lower contact portion and an upper contact portion having a horizontal extension that extends on an upper corner of the first gate structure, the insulation liner includes a first local region between the upper corner and the horizontal extension and a second local region that is farther from the substrate than the first local region, and a thickness of the first local region is greater than that of the second local region.

    INTEGRATED CIRCUIT DEVICE
    6.
    发明申请

    公开(公告)号:US20220246738A1

    公开(公告)日:2022-08-04

    申请号:US17472926

    申请日:2021-09-13

    IPC分类号: H01L29/417 H01L27/088

    摘要: An integrated circuit device includes a plurality of gate structures each including a gate line extending on a fin-type active region and insulation spacers on sidewalls of the gate line; a source/drain contact between first and second gate structures, and having opposing sides that are asymmetric in the first horizontal direction; and an insulation liner on sidewalls of the source/drain contact. The source/drain contact includes a lower contact portion and an upper contact portion having a horizontal extension that extends on an upper corner of the first gate structure, the insulation liner includes a first local region between the upper corner and the horizontal extension and a second local region that is farther from the substrate than the first local region, and a thickness of the first local region is greater than that of the second local region.