Invention Grant
- Patent Title: Semiconductor devices and method of fabricating the same
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Application No.: US18307279Application Date: 2023-04-26
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Publication No.: US12094974B2Publication Date: 2024-09-17
- Inventor: Jaemun Kim , Dahye Kim , Jinbum Kim , Gyeom Kim , Dohee Kim , Dongwoo Kim , Seunghun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200082374 2020.07.03
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L29/417 ; H01L29/66 ; H01L29/04

Abstract:
A semiconductor device includes a substrate including a fin-type active region, the fin-type active region extending in a first direction; a plurality of channel layers on the fin-type active region, the plurality of channel layers including an uppermost channel layer, a lowermost channel layer, and an intermediate channel layer isolated from direct contact with each other in a direction perpendicular to an upper surface of the substrate; a gate electrode surrounding the plurality of channel layers and extending in a second direction intersecting the first direction; a gate insulating film between the plurality of channel layers and the gate electrode; and source/drain regions electrically connected to the plurality of channel layers. In a cross section taken in the second direction, the uppermost channel layer has a width greater than a width of the intermediate channel layer.
Public/Granted literature
- US20230268441A1 SEMICONDUCTOR DEVICES AND METHOD OF FABRICATING THE SAME Public/Granted day:2023-08-24
Information query
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