Invention Grant
- Patent Title: Built-in connector for board-to-board and flex-to-rigid board connection
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Application No.: US17478221Application Date: 2021-09-17
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Publication No.: US12095185B2Publication Date: 2024-09-17
- Inventor: Lan H. Hoang , Takayoshi Katahira , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Manoj Vadeentavida , Jing Tao
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R12/52 ; H01R12/57 ; H01R12/58 ; H01R12/62 ; H01R12/79 ; H01R13/62 ; H01R13/631

Abstract:
Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.
Public/Granted literature
- US20230089258A1 Built-In Connector for Board-to-Board and Flex-to-Rigid Board Connection Public/Granted day:2023-03-23
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