公开(公告)号：US20230089258A1

公开(公告)日：2023-03-23

申请号：US17478221

申请日：2021-09-17

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Manoj Vadeentavida ,  Jing Tao

IPC分类号： H01R12/71 ,  H01R12/52 ,  H01R12/58 ,  H01R13/62 ,  H01R12/57 ,  H01R13/631 ,  H01R12/79 ,  H01R12/62

摘要： Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

公开(公告)号：US10334732B2

公开(公告)日：2019-06-25

申请号：US15713453

申请日：2017-09-22

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira

IPC分类号： H05K5/00 ,  H05K7/00 ,  H05K1/18 ,  H05K7/14 ,  H05K1/11 ,  H05K1/14

摘要： Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.

公开(公告)号：US10292258B2

公开(公告)日：2019-05-14

申请号：US15713705

申请日：2017-09-25

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K1/18 ,  H01L21/48 ,  H01L23/552 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H05K3/34 ,  H01L23/29 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/16

摘要： Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

公开(公告)号：US12095185B2

公开(公告)日：2024-09-17

申请号：US17478221

申请日：2021-09-17

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Manoj Vadeentavida ,  Jing Tao

IPC分类号： H01R12/71 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/62 ,  H01R13/631

CPC分类号： H01R12/718 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/6205 ,  H01R13/631

摘要： Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

公开(公告)号：US20190082538A1

公开(公告)日：2019-03-14

申请号：US16147469

申请日：2018-09-28

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Raghunandan R. Chaware ,  Chang Liu ,  Takayoshi Katahira

IPC分类号： H05K1/14 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01R12/71 ,  H01R12/70 ,  B23Q1/01

摘要： Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.

公开(公告)号：US20160270213A1

公开(公告)日：2016-09-15

申请号：US15041033

申请日：2016-02-11

申请人： APPLE INC.

发明人： Amir Salehi ,  Vu T. Vo ,  Wyeman Chen ,  Chang Liu ,  Dennis R. Pyper ,  Steven Patrick Cardinali ,  Lan Hoang ,  Siddharth Nangia ,  Meng Chi Lee ,  Takayoshi Katahira

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC分类号： H05K3/284 ,  B33Y80/00 ,  H05K1/0224 ,  H05K2201/0141 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2201/10969 ,  H05K2201/2036

摘要： Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

摘要翻译： 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。

公开(公告)号：US20230078536A1

公开(公告)日：2023-03-16

申请号：US17832346

申请日：2022-06-03

申请人： Apple Inc.

发明人： Ali N. Ergun ,  Bilal Mohamed Ibrahim Kani ,  Chang Liu ,  Ethan L. Huwe ,  Jeffrey J. Terlizzi ,  Jerzy S. Guterman ,  Jue Wang ,  Kishore N. Renjan ,  Kyusang Kim ,  Lan H. Hoang ,  Mandar S. Painaik ,  Manoj Vadeentavida ,  Sarah B. Gysbers ,  Takayoshi Katahira ,  Zhiqi Wang

IPC分类号： H05K1/02 ,  H05K1/11 ,  H01Q1/22 ,  H01Q1/36

摘要： System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

公开(公告)号：US10602612B1

公开(公告)日：2020-03-24

申请号：US16512280

申请日：2019-07-15

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira ,  Leilei Zhang ,  Raghunandan R. Chaware

IPC分类号： H05K1/14 ,  H05K1/11

摘要： Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

公开(公告)号：US20190098762A1

公开(公告)日：2019-03-28

申请号：US15713453

申请日：2017-09-22

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K7/14

CPC分类号： H05K1/182 ,  H05K1/112 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/145 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4691 ,  H05K7/1422 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1316

摘要： Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.

公开(公告)号：US20180049311A1

公开(公告)日：2018-02-15

申请号：US15713705

申请日：2017-09-25

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K1/18 ,  H05K3/28

CPC分类号： H05K1/0218 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4867 ,  H01L23/295 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/112 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15322 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/341 ,  H05K3/368 ,  H05K3/4038 ,  H05K9/0024 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

摘要： Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.