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公开(公告)号：US11817383B2
公开(公告)日：2023-11-14
申请号：US17685630
申请日：2022-03-03
申请人： Apple Inc.
发明人： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
IPC分类号： H01L23/498 , G01K13/20 , G01K1/08 , G01K7/02 , G01K7/16 , H01L23/00 , H01L23/28 , H01L23/538
CPC分类号： H01L23/4985 , G01K1/08 , G01K7/02 , G01K7/16 , G01K13/20 , H01L23/00 , H01L23/28 , H01L23/538
摘要： Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20230213715A1
公开(公告)日：2023-07-06
申请号：US17646784
申请日：2022-01-03
申请人： Apple Inc.
发明人： Scott D. Morrison , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Manoj Vadeentavida
CPC分类号： G02B6/428 , G02B6/0028 , G02B6/0081 , G02B6/4283 , G02B6/0065
摘要： Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.
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公开(公告)号：US12095185B2
公开(公告)日：2024-09-17
申请号：US17478221
申请日：2021-09-17
申请人： Apple Inc.
发明人： Lan H. Hoang , Takayoshi Katahira , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Manoj Vadeentavida , Jing Tao
IPC分类号： H01R12/71 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/62 , H01R12/79 , H01R13/62 , H01R13/631
CPC分类号： H01R12/718 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/62 , H01R12/79 , H01R13/6205 , H01R13/631
摘要： Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.
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公开(公告)号：US20240032203A1
公开(公告)日：2024-01-25
申请号：US18480303
申请日：2023-10-03
申请人： Apple Inc.
发明人： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC分类号： H05K1/186 , H05K1/189 , H05K1/0298 , H05K2201/10121 , H05K2201/10159 , H05K2201/10083 , H05K2201/10106 , H05K2201/10151 , H05K1/0274
摘要： Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11651976B2
公开(公告)日：2023-05-16
申请号：US16911153
申请日：2020-06-24
申请人： Apple Inc.
发明人： Kishore N. Renjan , Bilal Mohamed Ibrahim Kani , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Prashanth S. Holenarsipur , Praveesh Chandran , Vinodh Babu , Yuta Kuboyama
IPC分类号： H01L21/56 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/065
CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/49811 , H01L23/49827 , H01L23/5383 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/97 , H01L25/0655 , H01L2224/02372 , H01L2224/02373 , H01L2224/04105 , H01L2224/12105 , H01L2224/13099 , H01L2224/48135
摘要： Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.
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公开(公告)号：US20210181039A1
公开(公告)日：2021-06-17
申请号：US16711247
申请日：2019-12-11
申请人： Apple Inc.
发明人： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
摘要： Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20180053731A1
公开(公告)日：2018-02-22
申请号：US15241665
申请日：2016-08-19
申请人： Apple Inc.
IPC分类号： H01L23/552 , H01L21/56 , H01L23/29
CPC分类号： H01L23/552 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L25/0655 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K9/0024 , H05K9/0045
摘要： A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
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公开(公告)号：US12028982B2
公开(公告)日：2024-07-02
申请号：US18480303
申请日：2023-10-03
申请人： Apple Inc.
发明人： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC分类号： H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
摘要： Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US11864322B2
公开(公告)日：2024-01-02
申请号：US18164180
申请日：2023-02-03
申请人： Apple Inc.
发明人： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC分类号： H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
摘要： Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20230055647A1
公开(公告)日：2023-02-23
申请号：US17407670
申请日：2021-08-20
申请人： Apple Inc.
发明人： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
摘要： Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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