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公开(公告)号：US12148741B2
公开(公告)日：2024-11-19
申请号：US17806412
申请日：2022-06-10
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
IPC: H05K1/02 , G01D11/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L25/16 , H01R12/59 , H01R12/62 , H01R12/79 , H01R13/6581 , H01R43/20 , H05K1/18 , H05K3/14 , H05K3/18 , H10K59/131
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US11765838B2
公开(公告)日：2023-09-19
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
CPC classification number: H05K3/363 , H05K1/189 , H05K3/0014 , H05K3/3436 , H05K3/4038 , H05K2201/10151 , H05K2203/048
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US20230089258A1
公开(公告)日：2023-03-23
申请号：US17478221
申请日：2021-09-17
Applicant: Apple Inc.
Inventor： Lan H. Hoang , Takayoshi Katahira , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Manoj Vadeentavida , Jing Tao
Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.
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公开(公告)号：US20230055647A1
公开(公告)日：2023-02-23
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US20210384113A1
公开(公告)日：2021-12-09
申请号：US16892126
申请日：2020-06-03
Applicant: Apple Inc.
Inventor： Leilei Zhang , Lan H. Hoang
IPC: H01L23/498 , H01L23/31 , H01L21/56
Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.
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Patent Agency Ranking
公开(公告)号：US20190082538A1
公开(公告)日：2019-03-14
申请号：US16147469
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Lan H. Hoang , Raghunandan R. Chaware , Chang Liu , Takayoshi Katahira
Abstract: Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.
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公开(公告)号：US20230213715A1
公开(公告)日：2023-07-06
申请号：US17646784
申请日：2022-01-03
Applicant: Apple Inc.
Inventor： Scott D. Morrison , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Manoj Vadeentavida
CPC classification number: G02B6/428 , G02B6/0028 , G02B6/0081 , G02B6/4283 , G02B6/0065
Abstract: Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.
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公开(公告)号：US10334732B2
公开(公告)日：2019-06-25
申请号：US15713453
申请日：2017-09-22
Applicant: Apple Inc.
Inventor： Lan H. Hoang , Takayoshi Katahira
Abstract: Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.
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公开(公告)号：US10292258B2
公开(公告)日：2019-05-14
申请号：US15713705
申请日：2017-09-25
Applicant: Apple Inc.
Inventor： Lan H. Hoang , Takayoshi Katahira
IPC: H05K1/02 , H05K1/11 , H05K3/28 , H05K9/00 , H05K1/14 , H05K3/36 , H05K3/40 , H05K1/18 , H01L21/48 , H01L23/552 , H01L25/065 , H01L25/10 , H01L25/11 , H05K3/34 , H01L23/29 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/16
Abstract: Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.
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公开(公告)号：US12153268B2
公开(公告)日：2024-11-26
申请号：US17646784
申请日：2022-01-03
Applicant: Apple Inc.
Inventor： Scott D. Morrison , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Manoj Vadeentavida
Abstract: Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.
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