Invention Grant
- Patent Title: Semiconductor device having semiconductor device elements in a semiconductor layer
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Application No.: US17235989Application Date: 2021-04-21
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Publication No.: US12107130B2Publication Date: 2024-10-01
- Inventor: Ingo Muri , Johannes Konrad Baumgartl , Oliver Hellmund , Jacob Tillmann Ludwig , Iris Moder , Thomas Neidhart , Gerhard Schmidt , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2018111213.0 2018.05.09
- The original application number of the division: US16406773 2019.05.08
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/02 ; H01L21/223 ; H01L21/225 ; H01L21/265 ; H01L29/167

Abstract:
A semiconductor device includes a semiconductor substrate having a first dopant and a second dopant. A covalent atomic radius of a material of the semiconductor substrate is i) larger than a covalent atomic radius of the first dopant and smaller than a covalent atomic radius of the second dopant, or ii) smaller than the covalent atomic radius of the first dopant and larger than the covalent atomic radius of the second dopant. The semiconductor device further includes a semiconductor layer on the semiconductor substrate and semiconductor device elements in the semiconductor layer. A vertical concentration profile of the first dopant decreases along at least 80% of a distance between an interface of the semiconductor substrate and the semiconductor layer to a surface of the semiconductor substrate opposite to the interface.
Public/Granted literature
- US20210265468A1 SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMICONDUCTOR LAYER Public/Granted day:2021-08-26
Information query
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