发明授权
- 专利标题： Compression mounted technology (CMT) socket retention mechanisms to board or interposer
-
申请号： US17033401申请日： 2020-09-25
-
公开(公告)号： US12127363B2公开(公告)日： 2024-10-22
- 发明人: Feifei Cheng , Thomas Boyd , Kuang Liu , Steven A. Klein , Daniel Neumann , Mohanraj Prabhugoud
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt P.C.
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; H01R12/52
摘要：
Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.
公开/授权文献
信息查询
