- 专利标题: Diamond joined body and method for manufacturing diamond joined body
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申请号: US16972162申请日: 2019-03-27
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公开(公告)号: US12128482B2公开(公告)日: 2024-10-29
- 发明人: Hirotsugu Iwasaki , Jinning Li , Tadashi Yamaguchi , Shinichiro Yurugi
- 申请人: SUMITOMO ELECTRIC HARDMETAL CORP.
- 申请人地址: JP Hyogo
- 专利权人: SUMITOMO ELECTRIC HARDMETAL CORP.
- 当前专利权人: SUMITOMO ELECTRIC HARDMETAL CORP.
- 当前专利权人地址: JP Hyogo
- 代理机构: Renner, Otto, Boisselle & Sklar, LLP
- 优先权: JP 18116201 2018.06.19
- 国际申请: PCT/JP2019/013210 2019.03.27
- 国际公布: WO2019/244429A 2019.12.26
- 进入国家日期: 2020-12-04
- 主分类号: B23B27/14
- IPC分类号: B23B27/14 ; B22F3/12 ; B22F7/00 ; B22F7/06 ; B22F5/00
摘要:
A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 μm from the interface.
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