公开(公告)号：US12128482B2

公开(公告)日：2024-10-29

申请号：US16972162

申请日：2019-03-27

Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.

Inventor： Hirotsugu Iwasaki ,  Jinning Li ,  Tadashi Yamaguchi ,  Shinichiro Yurugi

IPC: B23B27/14 ,  B22F3/12 ,  B22F7/00 ,  B22F7/06 ,  B22F5/00

CPC classification number: B23B27/14 ,  B22F3/12 ,  B22F7/008 ,  B22F7/06 ,  B22F2005/001 ,  B22F2302/406 ,  B23B2226/315

Abstract: A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 μm from the interface.