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公开(公告)号：US11975392B2
公开(公告)日：2024-05-07
申请号：US18010273
申请日：2020-12-22
Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.
Inventor： Hideki Tomimoto , Hirotsugu Iwasaki , Satoru Kukino , Takashi Harada , Naoki Watanobe , Mayuka Segawa
IPC: E21B10/43 , B23B27/20 , B23P15/28 , E21B10/567
CPC classification number: B23B27/20 , B23P15/28 , E21B10/43 , E21B10/567 , B23B2222/28 , B23B2226/315 , B23B2265/32
Abstract: A cutting tool includes: a base metal provided with a seat portion; a blade edge member that is a polycrystalline diamond sintered material containing polycrystalline diamond and a binder; and a brazing material that fixes the blade edge member to the seat portion of the base metal. The blade edge member has a thickness of greater than or equal to 0.3 mm. The brazing material is disposed between a blade edge bottom face of the blade edge member and a seat bottom face of the seat portion and is in contact with the blade edge bottom face and the seat bottom face. The flank face is located outside of the base metal with respect to the lateral face of the base metal.
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公开(公告)号：US12128482B2
公开(公告)日：2024-10-29
申请号：US16972162
申请日：2019-03-27
Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.
Inventor： Hirotsugu Iwasaki , Jinning Li , Tadashi Yamaguchi , Shinichiro Yurugi
CPC classification number: B23B27/14 , B22F3/12 , B22F7/008 , B22F7/06 , B22F2005/001 , B22F2302/406 , B23B2226/315
Abstract: A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 μm from the interface.
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