Invention Grant
- Patent Title: Electronic component and method for manufacturing electronic component
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Application No.: US17412410Application Date: 2021-08-26
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Publication No.: US12131871B2Publication Date: 2024-10-29
- Inventor: Yasuhiro Tamatani , Kazuya Kusuda , Takeshi Furukawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 19035919 2019.02.28
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/012 ; H01G4/224 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; B01D1/26 ; B05D1/32 ; B05D5/12

Abstract:
An electronic component that includes an electronic component body including a first internal electrode exposed at a first end surface and a second internal electrode exposed at a second end surface; a first external electrode on the first end surface and a bottom surface of the electronic component body; and a second external electrode on the second end surface and the bottom surface of the electronic component body, wherein the first external electrode comprises a first end surface electrode and a first bottom surface electrode that are integrated, and a thickness of the first end surface electrode is smaller than a thickness of the first bottom surface electrode, and the second external electrode comprises a second end surface electrode and a second bottom surface electrode that are integrated, and a thickness of the second end surface electrode is smaller than a thickness of the second bottom surface electrode.
Public/Granted literature
- US20210383976A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2021-12-09
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