The present disclosure relates to a potting adhesive, including: a component A and a component B, the component A including a first liquid organic adhesive containing dimethyl siloxane, the component B including a second liquid organic adhesive containing methyl hydrogen siloxane and silicone oil, at least one of the component A and the component B further including ceramic particles which are spherical particles with a particle size of 0.1 mm to 3 mm. The present disclosure further relates to a heat dissipation device, including an adhesive potting groove, a transformer provided in the adhesive potting groove, and a filling medium which fills and is consolidated in a gap between the transformer and the adhesive potting groove.