Invention Grant
- Patent Title: Method for treating substrate
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Application No.: US17579303Application Date: 2022-01-19
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Publication No.: US12154796B2Publication Date: 2024-11-26
- Inventor: Joo Jib Park
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: PROCOPIO, CORY, HARGREAVES & SAVITCH LLP
- Priority: KR10-2018-0163690 20181218
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/08 ; B08B3/10 ; F26B5/00 ; H01L21/67
Abstract:
A method for treating a substrate, including a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate, a drying step of drying the substrate to remove the organic solvent on the substrate, and a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate, where the drying step and the bake step are performed in different chambers.
Public/Granted literature
- US20220139731A1 METHOD FOR TREATING SUBSTRATE Public/Granted day:2022-05-05
Information query
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