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公开(公告)号：US11862491B2
公开(公告)日：2024-01-02
申请号：US16925449
申请日：2020-07-10
Applicant: SEMES CO., LTD.
Inventor： Dohyeon Yoon , Joo Jib Park , Jin Se Park
IPC: H01L21/67 , B08B7/00 , H01L21/02 , H01L21/677
CPC classification number: H01L21/67115 , B08B7/0021 , H01L21/02101 , H01L21/67034 , H01L21/67742
Abstract: An apparatus for treating a substrate includes a light treatment chamber having an interior space, a support unit that supports the substrate in the interior space, and an irradiation unit that irradiates light to the substrate in the interior space to remove organic matter remaining on the substrate, in which the irradiation unit includes a first light source that irradiates first light to the substrate and a second light source that irradiates, to the substrate, second light having a different wavelength range from the first light.
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公开(公告)号：US10197333B2
公开(公告)日：2019-02-05
申请号：US15152979
申请日：2016-05-12
Applicant: Semes Co., Ltd.
Inventor： Boong Kim , Min Sung Han , Joo Jib Park , Woo Young Kim
Abstract: Disclosed is a substrate drying apparatus of substrate processing apparatus including a chamber that provides a space for processing a substrate, and a fluid supply unit that supplies a process fluid to the chamber, wherein the liquid supply unit includes a supply tank in which the fluid is stored, a supply line that connects the supply tank and the chamber, a branch line branched from a first point of the supply line and connected to a second point of the supply line, and a temperature control unit that adjusts the temperature of the fluid such that the temperatures of the fluids flowing through the supply line and the branch line between the first point and the second point are different.
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公开(公告)号：US11443938B2
公开(公告)日：2022-09-13
申请号：US16159839
申请日：2018-10-15
Applicant: SEMES CO., LTD.
Inventor： Boong Kim , Joo Jib Park , Woo Young Kim
Abstract: A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a chamber having a first housing and a second housing that are combined with each other to form a processing space inside, and a housing actuator that moves the first housing to open or close the processing space. The housing actuator includes a plurality of cylinder units coupled to the first housing, a fluid supplier that supplies a fluid for operating the plurality of cylinder units, and a deviation corrector that corrects an operation deviation between the plurality of cylinder units. The deviation corrector corrects the operation deviation between the plurality of cylinder units coupled to the chamber, thereby minimizing particles that are generated when the chamber is opened/closed.
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公开(公告)号：US12154796B2
公开(公告)日：2024-11-26
申请号：US17579303
申请日：2022-01-19
Applicant: SEMES CO., LTD.
Inventor： Joo Jib Park
Abstract: A method for treating a substrate, including a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate, a drying step of drying the substrate to remove the organic solvent on the substrate, and a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate, where the drying step and the bake step are performed in different chambers.
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公开(公告)号：US11735437B2
公开(公告)日：2023-08-22
申请号：US17132008
申请日：2020-12-23
Applicant: SEMES CO., LTD.
Inventor： Boong Kim , Oh Jin Kwon , Sungho Jang , Joo Jib Park
IPC: H01L21/67 , F26B25/14 , H01L21/677 , H01L21/687
CPC classification number: H01L21/67028 , F26B25/14 , H01L21/6719 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/67126 , H01L21/67178 , H01L21/67748 , H01L21/6875
Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
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Patent Agency Ranking
公开(公告)号：US10529594B2
公开(公告)日：2020-01-07
申请号：US15793263
申请日：2017-10-25
Applicant: SEMES CO., LTD.
Inventor： Do-Youn Lim , Joonho Won , Kisang Eum , Boong Kim , Joo Jib Park
Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.
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公开(公告)号：US20180102263A1
公开(公告)日：2018-04-12
申请号：US15834512
申请日：2017-12-07
Applicant: SEMES CO., LTD.
Inventor： Boong Kim , Oh Jin Kwon , Sungho Jang , Joo Jib Park
IPC: H01L21/67 , H01L21/687 , H01L21/677
CPC classification number: H01L21/67028 , F26B25/14 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/67126 , H01L21/67178 , H01L21/6719 , H01L21/67748 , H01L21/6875
Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.
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公开(公告)号：US11367635B2
公开(公告)日：2022-06-21
申请号：US16133043
申请日：2018-09-17
Applicant: SEMES CO., LTD.
Inventor： Sangmin Lee , Woo Young Kim , Joo Jib Park , Boong Kim
IPC: H01L21/67 , H01L21/687 , H01L21/673 , H01L21/02
Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.
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公开(公告)号：US20190096717A1
公开(公告)日：2019-03-28
申请号：US16133043
申请日：2018-09-17
Applicant: SEMES CO., LTD.
Inventor： Sangmin Lee , Woo Young Kim , Joo Jib Park , Boong Kim
IPC: H01L21/67 , H01L21/687 , H01L21/673 , H01L21/02
Abstract: Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each other to define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed.
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公开(公告)号：US20180114707A1
公开(公告)日：2018-04-26
申请号：US15793263
申请日：2017-10-25
Applicant: SEMES CO., LTD.
Inventor： Do-Youn Lim , Joonho Won , Kisang Eum , Boong Kim , Joo Jib Park
CPC classification number: H01L21/67034 , F26B5/04 , H01L21/02052 , H01L21/02101 , H01L21/6704 , H01L21/67051 , H01L21/6708 , H01L21/67109 , H01L21/67126 , H01L21/6715 , H01L21/6719 , H01L21/68742
Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.
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