Invention Grant
- Patent Title: Substrate-less electrostatic discharge (ESD) integrated circuit structures
-
Application No.: US17131616Application Date: 2020-12-22
-
Publication No.: US12166031B2Publication Date: 2024-12-10
- Inventor: Biswajeet Guha , Brian Greene , Daniel Schulman , William Hsu , Chung-Hsun Lin , Curtis Tsai , Kevin Fischer
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L23/60 ; H01L29/87

Abstract:
Substrate-less electrostatic discharge (ESD) integrated circuit structures, and methods of fabricating substrate-less electrostatic discharge (ESD) integrated circuit structures, are described. For example, a substrate-less integrated circuit structure includes a first fin and a second fin protruding from a semiconductor pedestal. An N-type region is in the first and second fins. A P-type region is in the semiconductor pedestal. A P/N junction is between the N-type region and the P-type region, the P/N junction on or in the semiconductor pedestal.
Public/Granted literature
- US20220199610A1 SUBSTRATE-LESS ELECTROSTATIC DISCHARGE (ESD) INTEGRATED CIRCUIT STRUCTURES Public/Granted day:2022-06-23
Information query
IPC分类: