Invention Grant
- Patent Title: MOSFET gate engineerinng with dipole films
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Application No.: US17667036Application Date: 2022-02-08
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Publication No.: US12230688B2Publication Date: 2025-02-18
- Inventor: Yong Yang , Srinivas Gandikota , Steven C. H. Hung , Mandyam Sriram , Jacqueline S. Wrench , Yixiong Yang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/40 ; H01L29/66 ; H01L29/78

Abstract:
A metal gate stack on a substrate comprises: an interfacial layer on the substrate; a high-κ metal oxide layer on the interfacial layer, the high-κ metal oxide layer comprising a dipole region adjacent to the interfacial layer, the dipole region comprising niobium (Nb); a high-κ metal oxide capping layer on the high-κ metal oxide layer; a positive metal-oxide-semiconductor (PMOS) work function material above the high-κ metal oxide capping layer; and a gate electrode above the PMOS work function material. The dipole region is formed by driving Nb species of a Nb-based film into the high-κ metal oxide layer to form a dipole region.
Public/Granted literature
- US20220254900A1 MOSFET GATE ENGINEERINNG WITH DIPOLE FILMS Public/Granted day:2022-08-11
Information query
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