Invention Grant
- Patent Title: Printed circuit board and method of fabricating the same
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Application No.: US18337706Application Date: 2023-06-20
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Publication No.: US12232273B2Publication Date: 2025-02-18
- Inventor: Yun Mi Bae , Soon Gyu Kwon , Sang Hwa Kim , Sang Young Lee , Jin Hak Lee , Han Su Lee , Dong Hun Jeong , In Ho Jeong , Dae Young Choi , Jung Ho Hwang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2015-0100404 20150715
- Main IPC: H05K1/02
- IPC: H05K1/02 ; C25D3/48 ; C25D5/02 ; C25D5/48 ; C25D7/12 ; H05K1/09 ; H05K1/11 ; H05K3/10 ; H05K3/18 ; H05K3/24 ; C25D3/38
Abstract:
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Public/Granted literature
- US20230337370A1 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME Public/Granted day:2023-10-19
Information query
