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公开(公告)号：US11297720B2
公开(公告)日：2022-04-05
申请号：US17236519
申请日：2021-04-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Yun Mi Bae , Soon Gyu Kwon , Sang Hwa Kim , Sang Young Lee , Jin Hak Lee , Han Su Lee , Dong Hun Jeong , In Ho Jeong , Dae Young Choi , Jung Ho Hwang
IPC: H05K1/09 , H05K3/24 , H05K3/18 , H05K3/10 , H05K1/02 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/11 , C25D3/38
Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US10798827B2
公开(公告)日：2020-10-06
申请号：US16717679
申请日：2019-12-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Yun Mi Bae , Soon Gyu Kwon , Sang Hwa Kim , Sang Young Lee , Jin Hak Lee , Han Su Lee , Dong Hun Jeong , In Ho Jeong , Dae Young Choi , Jung Ho Hwang
IPC: H05K1/11 , H05K1/02 , H05K3/24 , H05K3/18 , H05K3/10 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/09 , C25D3/38
Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US09686860B2
公开(公告)日：2017-06-20
申请号：US14831674
申请日：2015-08-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yun Mi Bae , Soon Gyu Kwon , Sang Hwa Kim , Sang Young Lee , Jin Hak Lee , Han Su Lee , Dong Hun Jeong , In Ho Jeong , Dae Young Choi , Jung Ho Hwang
IPC: H05K1/11 , H05K3/18 , H05K3/10 , H05K3/24 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/09
CPC classification number: H05K1/11 , C25D3/38 , C25D3/48 , C25D5/022 , C25D5/48 , C25D7/123 , H05K1/09 , H05K3/108 , H05K3/181 , H05K3/188 , H05K3/244 , H05K2201/0338 , H05K2201/098 , H05K2201/0989 , H05K2201/099 , H05K2203/1184
Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US11723153B2
公开(公告)日：2023-08-08
申请号：US17653054
申请日：2022-03-01
Applicant: LG INNOTEK CO., LTD.
Inventor： Yun Mi Bae , Soon Gyu Kwon , Sang Hwa Kim , Sang Young Lee , Jin Hak Lee , Han Su Lee , Dong Hun Jeong , In Ho Jeong , Dae Young Choi , Jung Ho Hwang
IPC: H05K1/11 , H05K3/24 , H05K3/18 , H05K3/10 , H05K1/02 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/09 , C25D3/38
CPC classification number: H05K3/244 , C25D3/48 , C25D5/022 , C25D5/48 , C25D7/123 , H05K1/0296 , H05K1/09 , H05K1/11 , H05K3/108 , H05K3/181 , H05K3/188 , C25D3/38 , H05K2201/0338 , H05K2201/098 , H05K2201/099 , H05K2201/0989 , H05K2203/1184
Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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公开(公告)号：US12232273B2
公开(公告)日：2025-02-18
申请号：US18337706
申请日：2023-06-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Yun Mi Bae , Soon Gyu Kwon , Sang Hwa Kim , Sang Young Lee , Jin Hak Lee , Han Su Lee , Dong Hun Jeong , In Ho Jeong , Dae Young Choi , Jung Ho Hwang
IPC: H05K1/02 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/12 , H05K1/09 , H05K1/11 , H05K3/10 , H05K3/18 , H05K3/24 , C25D3/38
Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
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Patent Agency Ranking
公开(公告)号：US20170055347A1
公开(公告)日：2017-02-23
申请号：US15241714
申请日：2016-08-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Jung Ho Hwang , Han Su Lee , Dae Young Choi , Soon Gyu Kwon , Dong Hun Jeong , In Ho Jeong , Kil Dong Son , Sang Hwa Kim , Sang Young Lee , Jae Hoon Jeon , Jin Hak Lee , Yun Mi Bae
CPC classification number: H05K3/188 , H05K1/0298 , H05K1/09 , H05K3/002 , H05K3/108 , H05K3/244 , H05K2201/0347 , H05K2201/098 , H05K2203/0548 , H05K2203/0588 , H05K2203/0723 , H05K2203/1184
Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
Abstract translation: 公开了印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层和形成在绝缘层上的电路图案，其中电路图案包括形成在绝缘层上并包括具有预定曲率的上部的角部的第一电路图案， 电路图案形成在第一电路图案上并且被配置为覆盖包括拐角部分的第一电路图案的上表面。
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公开(公告)号：US11889634B2
公开(公告)日：2024-01-30
申请号：US17135223
申请日：2020-12-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Jung Ho Hwang , Han Su Lee , Dae Young Choi , Soon Gyu Kwon , Dong Hun Jeong , In Ho Jeong , Kil Dong Son , Sang Hwa Kim , Sang Young Lee , Jae Hoon Jeon , Jin Hak Lee , Yun Mi Bae
IPC: H05K1/11 , H05K3/18 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/46 , H05K3/00 , H05K3/24 , H01L23/00
CPC classification number: H05K3/188 , H05K1/0298 , H05K1/09 , H05K3/002 , H05K3/108 , H05K3/184 , H05K3/467 , H05K3/4661 , H01L24/11 , H01L24/12 , H05K1/111 , H05K3/244 , H05K2201/0347 , H05K2201/098 , H05K2203/0548 , H05K2203/0588 , H05K2203/0723 , H05K2203/1184 , Y10T29/49147
Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
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公开(公告)号：US10912202B2
公开(公告)日：2021-02-02
申请号：US15406132
申请日：2017-01-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Jung Ho Hwang , Han Su Lee , Dae Young Choi , Soon Gyu Kwon , Dong Hun Jeong , In Ho Jeong , Kil Dong Son , Sang Hwa Kim , Sang Young Lee , Jae Hoon Jeon , Jin Hak Lee , Yun Mi Bae
IPC: H05K3/18 , H05K3/46 , H01K1/02 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/00 , H05K3/24 , H01L23/00
Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
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公开(公告)号：US09820378B2
公开(公告)日：2017-11-14
申请号：US15241714
申请日：2016-08-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Jung Ho Hwang , Han Su Lee , Dae Young Choi , Soon Gyu Kwon , Dong Hun Jeong , In Ho Jeong , Kil Dong Son , Sang Hwa Kim , Sang Young Lee , Jae Hoon Jeon , Jin Hak Lee , Yun Mi Bae
CPC classification number: H05K3/188 , H05K1/0298 , H05K1/09 , H05K3/002 , H05K3/108 , H05K3/244 , H05K2201/0347 , H05K2201/098 , H05K2203/0548 , H05K2203/0588 , H05K2203/0723 , H05K2203/1184
Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
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公开(公告)号：US12108531B2
公开(公告)日：2024-10-01
申请号：US17756541
申请日：2020-11-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Kyo Hun Koo , Jin Hak Lee , In Ho Jeong
CPC classification number: H05K1/115 , H05K1/0206 , H05K1/0218 , H05K3/424 , H05K2201/09563
Abstract: A circuit board according to an embodiment includes: an insulating layer including a through hole and a via disposed in the through hole and wherein the via including a first metal layer on an upper surface of the insulating layer and an inner wall of the through hole; and a second metal layer disposed in the through hole, and the an upper surface of the second metal layer includes a protruding portion that does not overlap an upper surface of the insulating layer in a vertical direction and is located higher than the first metal layer.
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