公开(公告)号：US11723153B2

公开(公告)日：2023-08-08

申请号：US17653054

申请日：2022-03-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/11 ,  H05K3/24 ,  H05K3/18 ,  H05K3/10 ,  H05K1/02 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/12 ,  H05K1/09 ,  C25D3/38

CPC classification number: H05K3/244 ,  C25D3/48 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/11 ,  H05K3/108 ,  H05K3/181 ,  H05K3/188 ,  C25D3/38 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/0989 ,  H05K2203/1184

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：US10007366B2

公开(公告)日：2018-06-26

申请号：US15026243

申请日：2014-09-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Young Lee ,  Tae Jin Lee ,  Hyun Seok Lim ,  Byung Youl Moon

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04104 ,  G06F2203/04108 ,  G06F2203/04112

Abstract: Disclosed is a touch window including a substrate, and a sensing electrode on the substrate. The sensing electrode comprises a plurality of sensing parts having directionalities different from each other.

公开(公告)号：US12232273B2

公开(公告)日：2025-02-18

申请号：US18337706

申请日：2023-06-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/02 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/12 ,  H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  C25D3/38

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：US10528195B2

公开(公告)日：2020-01-07

申请号：US15307751

申请日：2015-04-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Jin Lee ,  Sang Young Lee

IPC: G06F3/044 ,  G06F3/041 ,  G06F3/01 ,  G09G5/00

Abstract: Disclosed is a touch device including a display to display a screen image, and a radar system under the display to detect a touch.

公开(公告)号：US20170055347A1

公开(公告)日：2017-02-23

申请号：US15241714

申请日：2016-08-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Jung Ho Hwang ,  Han Su Lee ,  Dae Young Choi ,  Soon Gyu Kwon ,  Dong Hun Jeong ,  In Ho Jeong ,  Kil Dong Son ,  Sang Hwa Kim ,  Sang Young Lee ,  Jae Hoon Jeon ,  Jin Hak Lee ,  Yun Mi Bae

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K3/188 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/002 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/098 ,  H05K2203/0548 ,  H05K2203/0588 ,  H05K2203/0723 ,  H05K2203/1184

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.

Abstract translation: 公开了印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层和形成在绝缘层上的电路图案，其中电路图案包括形成在绝缘层上并包括具有预定曲率的上部的角部的第一电路图案， 电路图案形成在第一电路图案上并且被配置为覆盖包括拐角部分的第一电路图案的上表面。

公开(公告)号：US11019731B2

公开(公告)日：2021-05-25

申请号：US17005522

申请日：2020-08-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/24 ,  H05K3/18 ,  H05K3/10 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/12 ,  H05K1/09 ,  C25D3/38

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：US10531569B2

公开(公告)日：2020-01-07

申请号：US15878701

申请日：2018-01-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/11 ,  H05K3/24 ,  H05K3/18 ,  H05K3/10 ,  H05K1/09 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/12 ,  C25D3/38

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

公开(公告)号：US09913383B2

公开(公告)日：2018-03-06

申请号：US15594778

申请日：2017-05-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi Bae ,  Soon Gyu Kwon ,  Sang Hwa Kim ,  Sang Young Lee ,  Jin Hak Lee ,  Han Su Lee ,  Dong Hun Jeong ,  In Ho Jeong ,  Dae Young Choi ,  Jung Ho Hwang

IPC: H05K1/09 ,  H05K3/24 ,  H05K3/18 ,  C25D5/48 ,  C25D5/02 ,  C25D3/38 ,  C25D3/48 ,  C25D7/12

CPC classification number: H05K1/11 ,  C25D3/38 ,  C25D3/48 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  H05K1/09 ,  H05K3/108 ,  H05K3/181 ,  H05K3/188 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/1184

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein a width of a bottom surface of the surface treatment layer is narrower than a width of a top surface of the plating seed layer, wherein the bottom surface of the surface treatment layer includes: a first portion contacted with the circuit pattern layer; and a second portion non contacted with the circuit pattern layer, and wherein a width of a top surface of the circuit pattern layer is narrower than a width of a bottom surface of the circuit pattern layer.

公开(公告)号：US20170135223A1

公开(公告)日：2017-05-11

申请号：US15406132

申请日：2017-01-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Jung Ho Hwang ,  Han Su Lee ,  Dae Young Choi ,  Soon Gyu Kwon ,  Dong Hun Jeong ,  In Ho Jeong ,  Kil Dong Son ,  Sang Hwa Kim ,  Sang Young Lee ,  Jae Hoon Jeon ,  Jin Hak Lee ,  Yun Mi Bae

IPC: H05K3/18 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K3/188 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/002 ,  H05K3/108 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/098 ,  H05K2203/0548 ,  H05K2203/0588 ,  H05K2203/0723 ,  H05K2203/1184

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.

公开(公告)号：US20140307186A1

公开(公告)日：2014-10-16

申请号：US14354876

申请日：2012-10-29

Applicant: LG INNOTEK CO., LTD

Inventor： Ji Sun Yun ,  Sang Young Lee ,  Yong Jin Lee ,  Kyoung Hoon Chai

IPC: G06F3/044 ,  G06F3/045

CPC classification number: G06F3/044 ,  G06F3/045

Abstract: The touch panel according to the embodiment includes a first substrate and a second substrate spaced apart from each other; a position detecting electrode on at least one of the first and second substrates; a wire connecting the position detecting electrode to a substrate; and an intermediate layer being elastically deformed such that a thickness of the intermediate layer is varied.

Abstract translation: 根据实施例的触摸面板包括彼此间隔开的第一基板和第二基板; 在所述第一和第二基板中的至少一个上的位置检测电极; 将位置检测电极连接到基板的线; 并且中间层弹性变形，使得中间层的厚度变化。