Invention Grant
- Patent Title: Bus training with interconnected dice
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Application No.: US17823415Application Date: 2022-08-30
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Publication No.: US12235783B2Publication Date: 2025-02-25
- Inventor: Francesco Douglas Verna-Ketel , Hyun Yoo Lee , Smruti Subhash Jhaveri , John Christopher Sancon , Yang Lu , Kang-Yong Kim
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Colby Nipper PLLC
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/16

Abstract:
Described apparatuses and methods facilitate bus training with multiple dice, such as multiple memory dice. A controller can communicate with multiple dice over a bus to perform bus training by sending a test pattern and receiving in return a feedback pattern indicative of the bits detected by the dice. Because suitable signal timing can differ between dice, even those using the same bus, the controller may attempt to train each die separately from the others. In some situations, however, individualized training may be infeasible. To accommodate such situations, logic associated with two or more dice can combine the bits as detected from the test pattern into a combined feedback pattern. A timing parameter that is jointly suitable for multiple dice can be determined, and the bus training may be concluded, responsive to the combined feedback pattern matching the test pattern. The multiple dice may be stacked or linked.
Public/Granted literature
- US20240070101A1 Bus Training with Interconnected Dice Public/Granted day:2024-02-29
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