A column accommodation device (1) includes a housing in which a column accommodation space (4) is provided, and a chip column (6) having a plate-shape and having an internal flow path (40) filled with a separation medium (41) is accommodated in the column accommodation space (4). An outer surface of the chip column (6) is provided with openings (42) respectively communicating with both ends of the internal flow path. Inside of the column accommodation space (4) is provided with a guide (18) for guiding the chip column (6) to a predetermined position. The column accommodation device (1) includes a seal device (32) for connecting and releasing pipes (44) to and from the openings (42) of the chip column (6), and a controller (46) configured to perform operation control of the seal device (32), and the controller (46) is configured to fluidly connect the pipes (44) with respect to the openings (42) of the chip column (6) when it is determined that the chip column (6) is arranged at the predetermined position.