Invention Grant
- Patent Title: Critical dimension uniformity
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Application No.: US18360445Application Date: 2023-07-27
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Publication No.: US12254258B2Publication Date: 2025-03-18
- Inventor: Chi-Ta Lu , Chi-Ming Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: G06F30/39
- IPC: G06F30/39 ; G06F111/06

Abstract:
A method includes receiving a pattern layout for a mask, shrinking the pattern layout to form a shrunk pattern, determining centerlines for each of a plurality of features within the shrunk pattern, and snapping the centerline for each of the plurality of features to a grid. The grid represents a minimum resolution size of a mask fabrication tool. The method further includes, after snapping the centerline for each of the plurality of features to the grid, fabricating the mask with the shrunk pattern.
Public/Granted literature
- US20230367943A1 CRITICAL DIMENSION UNIFORMITY Public/Granted day:2023-11-16
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