Invention Grant
- Patent Title: Substrate processing method
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Application No.: US17863427Application Date: 2022-07-13
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Publication No.: US12255082B2Publication Date: 2025-03-18
- Inventor: Yuta Hamashima , Jun Nonaka
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2021-116117 20210714
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A substrate processing method arranges a plurality of substrates in a storage area of a chamber, supplies an organic solvent to the plurality of substrates, arranges the plurality of substrates in a drying area, supplies a vapor of a hydrophobizing agent from a hydrophobizing agent nozzle to the plurality of substrates, arranges the plurality of substrates in the storage area, supplies an organic solvent from a first organic solvent nozzle to the plurality of substrates, supplies a vapor of an organic solvent from a second organic solvent nozzle to the drying area in a state where a liquid is stored in the storage area and the plurality of substrates are dipped in a liquid.
Public/Granted literature
- US20230015936A1 SUBSTRATE PROCESSING METHOD Public/Granted day:2023-01-19
Information query
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