- Patent Title: Semiconductor memory devices and methods for fabricating the same
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Application No.: US17468739Application Date: 2021-09-08
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Publication No.: US12279537B2Publication Date: 2025-04-15
- Inventor: Hye Ji Yoon , O Ik Kwon , Yun Seung Kang , Sang-Kuk Kim , Gwang-Hyun Baek , Tae Hyung Lee , Su Jin Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2021-0001206 20210106
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H01L23/528 ; H10B63/00 ; H10N70/20

Abstract:
A semiconductor memory device in which performance is improved by reducing a wiring resistance is provided. The semiconductor memory device comprising an inter-wiring insulation film on a substrate, a first wiring pattern extending in a first direction, in the inter-wiring insulation film, a barrier insulation film that is on an upper surface of the inter-wiring insulation film, a barrier conductive pattern electrically connected to the first wiring pattern, in the barrier insulation film, a memory cell electrically connected to the barrier conductive pattern and including a selection pattern and a variable resistor pattern, and a second wiring pattern extending in a second direction intersecting the first direction, on the memory cell, wherein a width of the barrier conductive pattern in the second direction is different from a width in the second direction of a portion of the memory cell that is adjacent to the barrier conductive pattern.
Public/Granted literature
- US20220216402A1 SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME Public/Granted day:2022-07-07
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