Invention Application
- Patent Title: STRUCTURE AND METHOD OF FABRICATION FOR AN OPTICAL SWITCH
- Patent Title (中): 光学开关的制造结构和制造方法
-
Application No.: US09911492Application Date: 2001-07-25
-
Publication No.: US20030021520A1Publication Date: 2003-01-30
- Inventor: Aroon Tungare , Keryn Lian , Robert Lempkowski , Barbara Foley Barenburg
- Applicant: MOTOROLA, INC.
- Applicant Address: US IL Schaumburg
- Assignee: MOTOROLA, INC.
- Current Assignee: MOTOROLA, INC.
- Current Assignee Address: US IL Schaumburg
- Main IPC: G02B006/35
- IPC: G02B006/35 ; G02B006/12

Abstract:
A structure for an optical switch includes a reflective layer formed over a high quality epitaxial layer of piezoelectric compound semiconductor materials grown over a monocrystalline substrate, such as a silicon wafer. The piezoelectric layer can be activated to alter the path of light incident on the reflective layer. A compliant substrate is provided for growing the monocrystalline compound semiconductor layer. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying piezoelectric monocrystalline material layer.
Public/Granted literature
- US06594414B2 Structure and method of fabrication for an optical switch Public/Granted day:2003-07-15
Information query