Invention Application
- Patent Title: COATING METHOD
- Patent Title (中): 涂料方法
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Application No.: US10856836Application Date: 2004-06-01
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Publication No.: US20040219288A1Publication Date: 2004-11-04
- Inventor: Shinichi Hayashi , Hirofumi Ookuma , Kouichi Suefuji
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo-to
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo-to
- Priority: JP2001-321007 20011018
- Main IPC: B05D001/00
- IPC: B05D001/00 ; B05C011/02 ; B05C013/00

Abstract:
A processing solution is supplied from processing-solution suppliers onto the surfaces of targets to be processed while a flow rate of the processing solution is being adjusted. The processing solution is fed from a processing-solution supply source at a specific pressure via a processing-solution pressure-up feeder. The pressure of the processing solution fed via the processing-solution pressure-up feeder is adjust to another specific pressure or more at least when the processing-solution suppliers are operating simultaneously. A flow-rate detector detects the flow rate of the processing solution supplied from each processing-solution supplier. A pressure detector detects the pressure of the processing solution fed via the processing-solution pressure-up feeder. The flow-rate adjuster and the pressure adjuster are controlled based on prestored control data and detection signals from the flow-rate detector and the pressure detector so that the same amount of processing solution is supplied to the targets from the processing-solution suppliers.
Public/Granted literature
- US06830774B2 Coating method Public/Granted day:2004-12-14
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