中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

175 records (took 0.024 seconds)

    Method for analyzing thin-film layer structure using spectroscopic ellipsometer
    1.
    发明申请
    Method for analyzing thin-film layer structure using spectroscopic ellipsometer 有权
    使用光谱椭偏仪分析薄膜层结构的方法

    公开(公告)号：US20040265477A1

    公开(公告)日：2004-12-30

    申请号：US10488596

    申请日：2004-08-25

    Inventor： Nataliya Nabatova-Gabain ,  Yoko Wasai

    IPC: B05D001/00

    CPC classification number: G01J4/04 ,  G01B11/0641 ,  G01N21/211

    Abstract: With extremely-thin-film and thin-film measurement, models are formed based upon a combination of film thickness, optical constants obtained using the dispersion formula, incident angle, etc., and the model and measured spectrums are fit by BLMC for a single layer of a structure with a certain number of iterations, obtaining information regarding the single layer. With thin-film multi-layer-structure measurement, models are formed for multiple layers of a thin-film multi-layer structure likewise, and fit by BLMC or EBLMC, obtaining information regarding the thin-film multi-layer structure. In either measurement, light is cast onto a thin film on a substrate to be measured while changing the wavelength as a parameter in order to obtain the spectrums nullE(nulli) and nullE(nulli) for each wavelength nulli, representing the change in polarization between the incident and reflected light. The measured spectrums are fit, obtaining the best model. The results are confirmed and stored, as necessary.

    Arrangement for monitoring a thickness of a layer depositing on a sidewall of a processing chamber
    2.
    发明申请
    Arrangement for monitoring a thickness of a layer depositing on a sidewall of a processing chamber 审中-公开
    用于监测沉积在处理室的侧壁上的层的厚度的布置

    公开(公告)号：US20040253824A1

    公开(公告)日：2004-12-16

    申请号：US10861902

    申请日：2004-06-04

    Inventor： Volker Tegeder

    IPC: B05D001/00 ,  H01L021/311 ,  H05H001/00

    CPC classification number: H01J37/32935 ,  C23C16/4407 ,  C23C16/52 ,  G01B11/0683

    Abstract: A light source (1) emits a light beam (6) into a plasma chamber (5) onto a sensor (2), which provides a measurement of the thickness of a film layer depositing on its surface (58) by means of a reflection or re-emission of light through the depositing layer (10) back on a detector (3), which is preferably mounted outside the plasma chamber (5). The arrangement allows an online measurement of the growing thickness of the depositing layer (10) during, e.g., plasma CVD- or plasma etching processes in semiconductor manufacturing. Providing a mirror layer (53) with sensor (2) the reflected light intensity can be compared with the incident light beam (6) intensity leading to a thickness determination by means of known absorption or interference curves.

    Abstract translation: 光源（1）将等离子体室（5）中的光束（6）发射到传感器（2）上，其通过反射提供沉积在其表面（58）上的膜层的厚度的测量 或将光通过沉积层（10）重新发射回到优选安装在等离子体室（5）外部的检测器（3）上。 该布置允许在例如半导体制造中的等离子体CVD或等离子体蚀刻工艺期间在线测量沉积层（10）的生长厚度。 提供具有传感器（2）的镜面层（53），可以将反射光强度与入射光束（6）进行比较，从而通过已知的吸收或干涉曲线进行厚度测定。

    COATING METHOD
    3.
    发明申请
    COATING METHOD 失效
    涂料方法

    公开(公告)号：US20040219288A1

    公开(公告)日：2004-11-04

    申请号：US10856836

    申请日：2004-06-01

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Shinichi Hayashi ,  Hirofumi Ookuma ,  Kouichi Suefuji

    IPC: B05D001/00 ,  B05C011/02 ,  B05C013/00

    CPC classification number: H01L21/6715

    Abstract: A processing solution is supplied from processing-solution suppliers onto the surfaces of targets to be processed while a flow rate of the processing solution is being adjusted. The processing solution is fed from a processing-solution supply source at a specific pressure via a processing-solution pressure-up feeder. The pressure of the processing solution fed via the processing-solution pressure-up feeder is adjust to another specific pressure or more at least when the processing-solution suppliers are operating simultaneously. A flow-rate detector detects the flow rate of the processing solution supplied from each processing-solution supplier. A pressure detector detects the pressure of the processing solution fed via the processing-solution pressure-up feeder. The flow-rate adjuster and the pressure adjuster are controlled based on prestored control data and detection signals from the flow-rate detector and the pressure detector so that the same amount of processing solution is supplied to the targets from the processing-solution suppliers.

    Method for improving the uniformity of a wet coating on a substrate using pick-and-place devices
    6.
    发明申请
    Method for improving the uniformity of a wet coating on a substrate using pick-and-place devices 有权
    使用拾取和放置装置改善衬底上湿涂层均匀性的方法

    公开(公告)号：US20040187773A1

    公开(公告)日：2004-09-30

    申请号：US10821588

    申请日：2004-04-09

    Applicant: 3M Innovative Properties Company

    Inventor： William K. Leonard ,  David W. Leonard ,  Albert E. Seaver

    IPC: B05D001/00 ,  B05C001/00

    CPC classification number: B05C11/025 ,  B05C5/0208

    Abstract: The uniformity of a wet coating on a substrate is improved by contacting the coating at a first position with the wetted surfaces of periodic pick-and-place devices, and re-contacting the coating with such wetted surfaces at positions on the substrate that are different from the first position and not periodically related to one another with respect to their distance from the first position. A coating is applied to a substrate by applying an uneven wet coating, contacting the coating at a first position with the wetted surfaces of periodic pick-and-place devices, and re-contacting the coating with such wetted surfaces at positions on the substrate that are different from the first position and not periodically related to one another with respect to their distance from the first position. These methods can provide extremely uniform coatings and extremely thin coatings, at very high rates of speed. The coatings can be applied in lanes with sharply defined edges and independently adjustable coating calipers. The pick-and-place devices facilitate drying and reduce the sensitivity of drying ovens to coating caliper surges. Equipment to carry out these methods is simple to construct, set up and operate, and can easily be adjusted to alter coating thickness and compensate for coating variation.

    Abstract translation: 通过使第一位置的涂层与周期性取放装置的润湿表面接触，并且使涂层与基底上不同的位置处的这些润湿表面接触来改善衬底上的湿涂层的均匀性 相对于与第一位置的距离，从第一位置开始并且不周期性地相关联。 通过施加不均匀的湿涂层将涂层施加到基底上，使第一位置的涂层与周期性拾取和放置装置的润湿表面接触，并将涂层与这样的润湿表面重新接触在基底上的位置， 与第一位置不同，并且相对于与第一位置的距离彼此不周期性地相关。 这些方法可以以非常高的速度提供非常均匀的涂层和极薄的涂层。 涂层可以应用在具有尖锐边缘的车道和独立可调涂层卡钳。 拾放装置便于干燥，并降低干燥炉对涂层卡尺冲击的敏感性。 执行这些方法的设备易于构造，设置和操作，并且可以容易地调整以改变涂层厚度并补偿涂层变化。

    Device, method and arrangement for pressing two axis-parallel rollers approachable to one another in a device for producing and/or treating a web of material
    7.
    发明申请
    Device, method and arrangement for pressing two axis-parallel rollers approachable to one another in a device for producing and/or treating a web of material 失效
    用于在用于生产和/或处理材料网的装置中彼此接近的两轴平行辊压紧的装置，方法和装置

    公开(公告)号：US20040185171A1

    公开(公告)日：2004-09-23

    申请号：US10719201

    申请日：2003-11-21

    Inventor： Manfred Ueberschar ,  Christoph Henninger ,  Eckard Wozny ,  Horst Kaipf

    IPC: B05C001/06 ,  B05D001/00

    CPC classification number: D21G1/004 ,  B05C1/083 ,  B05C9/04 ,  D21F3/06 ,  D21H23/56

    Abstract: Two axially parallel rolls are pressed against each other in a device for producing and/or treating a moving material web. Sensor elements are arranged in the force transmission path running from the force-producing elements via the rolls, outside roll bodies of the two rolls. As a result of displacing the sensor elements out of the roll bodies of the rolls, the production of the rolls is less complicated and less expensive. No sensors have to be embedded in the roll bodies, which opens up the possibility of using standard rolls. In addition, the occasional grinding of the rolls can in this way be performed without any regard to the sensor elements. Nevertheless, the pressure prevailing between the rolls can continue to be measured directly, since the sensor elements are arranged in the transmission path of the pressing force.

    Abstract translation: 两个轴向平行的辊在用于生产和/或处理移动材料幅材的装置中彼此压靠。 传感器元件布置在力传递路径中，从力产生元件经由辊，两个辊的外侧辊体运动。 由于将传感器元件从辊的辊体移出，所以辊的生产不那么复杂并且成本较低。 不必将传感器嵌入辊体中，这样可以打开使用标准辊的可能性。 此外，不用考虑传感器元件就可以以这种方式偶尔研磨辊。 然而，由于传感器元件布置在压力的传输路径中，因此辊之间的压力可以继续直接测量。

    Method for dispensing flowable substances on microelectronic substrates
    8.
    发明申请
    Method for dispensing flowable substances on microelectronic substrates 审中-公开

    公开(公告)号：US20040146648A1

    公开(公告)日：2004-07-29

    申请号：US10733019

    申请日：2003-12-10

    Inventor： John T. Davlin ,  Greg Montanino

    IPC: B05D005/00 ,  B05D001/00

    CPC classification number: H01L21/67253 ,  G03F7/162 ,  H01L21/6715

    Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

    Apparatus for aligning dispenser and aligning method thereof
    9.
    发明申请
    Apparatus for aligning dispenser and aligning method thereof 审中-公开
    用于对准分配器的装置及其对准方法

    公开(公告)号：US20040131757A1

    公开(公告)日：2004-07-08

    申请号：US10717717

    申请日：2003-11-21

    Applicant: LG.Philips LCD Co., Ltd.

    Inventor： Sung-Su Jung ,  Yong-Keun Kwak

    IPC: B05D001/02 ,  B05D001/00 ,  B05C011/00

    CPC classification number: B05B12/122

    Abstract: An apparatus for aligning a dispenser includes: a table that can move horizontally in forward/backward and left/right directions for receiving a substrate of at least one liquid crystal display panel; first and second dummy aligning plates on the table with a certain space therebetween; a syringe for supplying a sealant onto the first and second dummy aligning plates to form first and second alignment patterns; a first image camera for detecting an image of the first alignment pattern; a second image camera for detecting an image of the second alignment pattern; and an alignment controller for aligning the image of the first image camera with a first reference position and the image of the second image camera with a second reference position.

    Abstract translation: 用于对准分配器的装置包括：能够在前后/左右方向上水平移动的台，用于接收至少一个液晶显示面板的基板; 第一和第二虚拟对准板在桌子上具有一定的间隔; 用于将密封剂供应到第一和第二虚拟对准板上以形成第一和第二对准图案的注射器; 用于检测第一对准图案的图像的第一图像摄像机; 用于检测第二对准图案的图像的第二图像相机; 以及对准控制器，用于将第一图像相机的图像与第一参考位置对准，并且具有第二参考位置的第二图像相机的图像。

Patent Agency Ranking