发明申请
- 专利标题： Method of mounting electronic part and flux-fill
- 专利标题（中）： 安装电子部件和焊剂填充的方法
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申请号： US10816915申请日： 2004-04-05
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公开(公告)号： US20050001014A1公开(公告)日： 2005-01-06
- 发明人: Shuichi Takeuchi , Hidehiko Kira , Kenji Kobae , Norio Kainuma , Hiroshi Kobayashi , Takayoshi Matsumura , Shigeo Matsunuma , Tomohisa Yagi
- 申请人： Shuichi Takeuchi , Hidehiko Kira , Kenji Kobae , Norio Kainuma , Hiroshi Kobayashi , Takayoshi Matsumura , Shigeo Matsunuma , Tomohisa Yagi
- 申请人地址： JP KAWASAKI
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP KAWASAKI
- 优先权： JP2003-192275 20030704
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K1/06 ; B23K1/20 ; B23K3/06 ; H01L21/56 ; H01L21/60 ; H01L21/607 ; H05K3/32 ; H05K3/34 ; B23K20/10 ; B23K31/02
摘要：
The method of mounting an electronic part is capable of securely mounting the electronic part having fine solder bumps without excessively heating the part. The method of comprises the steps of: applying flux-fill, which acts as flux and under-filling resin, on a surface of a mount board, in which electrodes are formed; respectively connecting solder bums of the electronic part with the electrodes; and simultaneously filling a gap between the electronic part and the mount board with the flux-fill, wherein the solder bumps are made contact with the electrodes, and ultrasonic vibration energy is applied to contact portions of the solder bumps and the electrodes in the connecting step.
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