Invention Application
US20050016251A1 Forming tool for forming a contoured microelectronic spring mold
审中-公开
用于形成轮廓微电子弹簧模具的成型工具
- Patent Title: Forming tool for forming a contoured microelectronic spring mold
- Patent Title (中): 用于形成轮廓微电子弹簧模具的成型工具
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Application No.: US10919151Application Date: 2004-08-16
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Publication No.: US20050016251A1Publication Date: 2005-01-27
- Inventor: Benjamin Eldridge , Stuart Wenzel
- Applicant: Benjamin Eldridge , Stuart Wenzel
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R1/067 ; G01R1/073 ; G01R3/00 ; H01L21/768 ; H01L23/48 ; H01L23/482 ; H01R13/24 ; H05K3/40 ; H05K7/10 ; B21D31/00

Abstract:
A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
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