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    Canal hearing devices and batteries for use with same
    1.
    发明授权
    Canal hearing devices and batteries for use with same 有权
    运河听力装置和电池与其一起使用

    公开(公告)号：US08761423B2

    公开(公告)日：2014-06-24

    申请号：US13303576

    申请日：2011-11-23

    Applicant: Paul Wagner ,  Stuart Wenzel ,  Michael Au ,  Igal Ladabaum

    Inventor： Paul Wagner ,  Stuart Wenzel ,  Michael Au ,  Igal Ladabaum

    IPC: H04R25/00

    CPC classification number: H04R25/608 ,  H04R25/02 ,  H04R25/30 ,  H04R25/554 ,  H04R25/602 ,  H04R25/604 ,  H04R25/65 ,  H04R25/654 ,  H04R25/658 ,  H04R2225/023 ,  H04R2225/49 ,  H04R2225/61 ,  H04R2460/17

    Abstract: Hearing devices configured to fit within the bony portion of the ear canal and batteries that may be used with same. One such hearing device includes a hearing device core, defining a size and a shape, and including a battery and an acoustic assembly, with a microphone and a receiver with a sound port that is adjacent to a portion of the battery, and a flexible seal apparatus on the hearing device core. The size, shape and configuration of the hearing device core, and the flexibility of the seal, are such that the hearing device is positionable within the ear canal bony region with the entire microphone medial of the bony-cartilaginous junction.

    Abstract translation: 听力装置被配置成装配在耳道的骨部分和可以与其一起使用的电池。 一种这样的听力装置包括限定尺寸和形状的听力装置芯，并且包括电池和声学组件，麦克风和具有与电池的一部分相邻的声音端口的接收器，以及柔性密封件 设备在听力设备核心上。 听力装置芯的尺寸，形状和构型以及密封的灵活性使得听力装置可以位于耳道内的骨 - 软骨连接处的整个麦克风内部的耳道骨区域内。

    IMPLANTABLE ANTENNA
    3.
    发明申请
    IMPLANTABLE ANTENNA 审中-公开
    可植入天线

    公开(公告)号：US20090149918A1

    公开(公告)日：2009-06-11

    申请号：US11951376

    申请日：2007-12-06

    Applicant: Peter Krulevitch ,  Michael R. Tracey ,  Stuart Wenzel

    Inventor： Peter Krulevitch ,  Michael R. Tracey ,  Stuart Wenzel

    IPC: A61N1/00

    CPC classification number: A61N1/36 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3787

    Abstract: An antenna implantable through minimally invasive techniques, preferably comprising a coil with conductive probes is provided. The antenna is preferably superelastic nickel-titanium having an insulative coating. The antenna may conduct a signal originating from a device external to the body of the implantee, or from another implanted device connected to the antenna depending on whether the antenna is employed for sending, receiving, or transceiving signals. Signals may contain data, operational commands, and may be used to transfer power. The implantable antenna may be connected to another implanted device, such as a blood pressure monitor, or may be implanted as a stand-alone device for purposes such as stimulating tissue.

    Abstract translation: 提供通过微创技术可植入的天线，优选地包括具有导电探针的线圈。 天线优选为具有绝缘涂层的超弹性镍钛。 根据天线是否用于发送，接收或收发信号，天线可以传送源自植入物体的外部的装置的信号，或者连接到天线的另一植入装置。 信号可能包含数据，操作命令，并可用于传输电力。 植入式天线可以连接到另一植入装置，例如血压监测器，或者可以作为独立装置植入，用于刺激组织等目的。

    Method for forming microelectronic spring structures on a substrate
    5.
    发明申请
    Method for forming microelectronic spring structures on a substrate 审中-公开
    在基板上形成微电子弹簧结构的方法

    公开(公告)号：US20060019027A1

    公开(公告)日：2006-01-26

    申请号：US11189954

    申请日：2005-07-25

    Applicant: Benjamin Eldridge ,  Stuart Wenzel

    Inventor： Benjamin Eldridge ,  Stuart Wenzel

    IPC: H05K3/00 ,  C23C28/00

    CPC classification number: G01R1/06716 ,  G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  Y10T29/49147 ,  H01L2924/00

    Abstract: A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.

    Abstract translation: 公开了一种用于制造微电子弹簧结构的方法。 在该方法的初始步骤中，在衬底上形成牺牲材料层。 然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。 轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。 如果需要，则牺牲层被固化或硬化。 弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。 然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。 单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。 还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。 在替代方法的初始步骤中，在衬底上提供一层材料。 然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。 流体被固化或硬化以稳定弯液面的轮廓形状。 然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

    Ultrasonic position sensor
    6.
    发明授权
    Ultrasonic position sensor 失效
    超声波位置传感器

    公开(公告)号：US5591914A

    公开(公告)日：1997-01-07

    申请号：US480162

    申请日：1995-06-07

    Applicant: Richard M. White ,  Stuart Wenzel ,  Eric R. Minami

    Inventor： Richard M. White ,  Stuart Wenzel ,  Eric R. Minami

    IPC: G01D5/48 ,  G01H9/00 ,  G01S11/12 ,  G01S11/14 ,  G10K15/04 ,  H03B5/30 ,  G01B11/14

    CPC classification number: G01D5/48 ,  G01H9/00 ,  G01S11/12 ,  G01S11/14 ,  G10K15/046 ,  A61B5/0066

    Abstract: A position sensor for measuring the distance from a first position to a second position. The sensor may include an elastic wave generator, an acoustical path over which the elastic wave passes, and a transducer to which the wave passes. A measurement loop includes the acoustical path, and has electrical and optical elements. The electrical elements may compare the phases of the transducer signals from which the change in position between the first and second positions are determined. Alternatively, the measurement loop may comprise a feedback loop to produce oscillations and an output frequency. A frequency counter is included in the feedback loop to measure frequency.

    Abstract translation: 一种用于测量从第一位置到第二位置的距离的位置传感器。 传感器可以包括弹性波发生器，弹性波穿过的声道和波通过的换能器。 测量回路包括声道，并具有电光元件。 电气元件可以比较确定第一和第二位置之间的位置变化的换能器信号的相位。 或者，测量回路可以包括产生振荡和输出频率的反馈回路。 反馈回路中包含频率计数器以测量频率。

    Lithographic Type Microelectronic Spring Structures with Improved Contours
    9.
    发明申请
    Lithographic Type Microelectronic Spring Structures with Improved Contours 失效
    具有改进轮廓的平版印刷型微电子弹簧结构

    公开(公告)号：US20070045874A1

    公开(公告)日：2007-03-01

    申请号：US11551621

    申请日：2006-10-20

    Applicant: Benjamin Eldridge ,  Stuart Wenzel

    Inventor： Benjamin Eldridge ,  Stuart Wenzel

    IPC: H01L23/52

    CPC classification number: H05K7/1069 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49151 ,  Y10T29/4922

    Abstract: Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.

    Abstract translation: 公开了改进的光刻型微电子弹簧结构和方法，用于提供改善的基板上的尖端高度，改进的弹性范围，增加的强度和可靠性以及增加的弹簧刚度。 改进的结构适于由沉积在模制的牺牲衬底上的单个集成层（或一系列层）形成，从而避免多个阶梯式光刻层并降低制造成本。 特别地，为了实现上述改进，公开了在z方向上成形的平版印刷结构。 例如，公开了具有沿着弹簧的长度延伸的U形横截面，V形横截面和/或一个或多个肋的结构。 本发明另外提供了一种平版印刷型弹性接触件，其被波纹化以增加其有效长度和弹性范围并减小其在基底上的覆盖面，以及在俯视图中成形的弹簧。 本发明还提供了用于光刻型微电子弹簧结构的组合（串联和并联）电接触尖端。 根据本发明的微电子弹簧结构特别适用于制造用于集成电路和其它基板安装的电子设备的电连接器的非常精细的间距阵列，因为它们的性能特性被增强，同时它们可以是 与其他光刻型微电子弹簧结构相比大大降低了成本。

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