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    Lithographic Type Microelectronic Spring Structures with Improved Contours
    1.
    发明申请
    Lithographic Type Microelectronic Spring Structures with Improved Contours 失效
    具有改进轮廓的平版印刷型微电子弹簧结构

    公开(公告)号：US20070045874A1

    公开(公告)日：2007-03-01

    申请号：US11551621

    申请日：2006-10-20

    Applicant: Benjamin Eldridge ,  Stuart Wenzel

    Inventor： Benjamin Eldridge ,  Stuart Wenzel

    IPC: H01L23/52

    CPC classification number: H05K7/1069 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49151 ,  Y10T29/4922

    Abstract: Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.

    Abstract translation: 公开了改进的光刻型微电子弹簧结构和方法，用于提供改善的基板上的尖端高度，改进的弹性范围，增加的强度和可靠性以及增加的弹簧刚度。 改进的结构适于由沉积在模制的牺牲衬底上的单个集成层（或一系列层）形成，从而避免多个阶梯式光刻层并降低制造成本。 特别地，为了实现上述改进，公开了在z方向上成形的平版印刷结构。 例如，公开了具有沿着弹簧的长度延伸的U形横截面，V形横截面和/或一个或多个肋的结构。 本发明另外提供了一种平版印刷型弹性接触件，其被波纹化以增加其有效长度和弹性范围并减小其在基底上的覆盖面，以及在俯视图中成形的弹簧。 本发明还提供了用于光刻型微电子弹簧结构的组合（串联和并联）电接触尖端。 根据本发明的微电子弹簧结构特别适用于制造用于集成电路和其它基板安装的电子设备的电连接器的非常精细的间距阵列，因为它们的性能特性被增强，同时它们可以是 与其他光刻型微电子弹簧结构相比大大降低了成本。

    Method for forming microelectronic spring structures on a substrate
    5.
    发明申请
    Method for forming microelectronic spring structures on a substrate 审中-公开
    在基板上形成微电子弹簧结构的方法

    公开(公告)号：US20060019027A1

    公开(公告)日：2006-01-26

    申请号：US11189954

    申请日：2005-07-25

    Applicant: Benjamin Eldridge ,  Stuart Wenzel

    Inventor： Benjamin Eldridge ,  Stuart Wenzel

    IPC: H05K3/00 ,  C23C28/00

    CPC classification number: G01R1/06716 ,  G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  Y10T29/49147 ,  H01L2924/00

    Abstract: A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.

    Abstract translation: 公开了一种用于制造微电子弹簧结构的方法。 在该方法的初始步骤中，在衬底上形成牺牲材料层。 然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。 轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。 如果需要，则牺牲层被固化或硬化。 弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。 然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。 单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。 还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。 在替代方法的初始步骤中，在衬底上提供一层材料。 然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。 流体被固化或硬化以稳定弯液面的轮廓形状。 然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY
    7.
    发明申请
    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号：US20080042668A1

    公开(公告)日：2008-02-21

    申请号：US11877466

    申请日：2007-10-23

    Applicant: Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    Inventor： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    IPC: G01R1/073

    CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

    Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    Abstract translation: 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

    Electrical Contactor, Espcecially Wafer Level Contactor, Using Fluid Pressure
    8.
    发明申请
    Electrical Contactor, Espcecially Wafer Level Contactor, Using Fluid Pressure 失效
    电气接触器，异型晶圆级接触器，使用流体压力

    公开(公告)号：US20070287304A1

    公开(公告)日：2007-12-13

    申请号：US11691369

    申请日：2007-03-26

    Applicant: Benjamin Eldridge

    Inventor： Benjamin Eldridge

    IPC: H01R12/00

    CPC classification number: G01R31/2887 ,  G01R1/0735 ,  G01R31/2886

    Abstract: An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

    Abstract translation: 电互连组件和用于制造电互连组件的方法。 在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。 当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。 在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。 在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。 在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。 压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。

    WIRELESS TEST SYSTEM
    9.
    发明申请
    WIRELESS TEST SYSTEM 有权
    无线测试系统

    公开(公告)号：US20070210822A1

    公开(公告)日：2007-09-13

    申请号：US11749004

    申请日：2007-05-15

    Applicant: Igor Khandros ,  Benjamin Eldridge ,  A. Sporck ,  Charles Miller

    Inventor： Igor Khandros ,  Benjamin Eldridge ,  A. Sporck ,  Charles Miller

    IPC: G01R31/26

    CPC classification number: G01R31/3025 ,  G01R31/31907 ,  G01R31/31908

    Abstract: One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

    Abstract translation: 一个或多个测试人员与一个或多个测试台无线通信。 无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。 无线通信还可以包括将测试结果传输给测试者。 消息也可以被无线地交换。

    Stacked Guard Structures
    10.
    发明申请
    Stacked Guard Structures 有权
    堆叠式防护结构

    公开(公告)号：US20070205780A1

    公开(公告)日：2007-09-06

    申请号：US11308094

    申请日：2006-03-06

    Applicant: Benjamin Eldridge

    Inventor： Benjamin Eldridge

    IPC: G01R31/02

    CPC classification number: G01R1/07378 ,  G01R31/2889 ,  H05K1/0216 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09672

    Abstract: Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.

    Abstract translation: 公开了一种用于提供具有嵌入堆叠中的保护平面的堆叠的系统和方法。 可以通过形成包括导电信号结构，电保护结构和布置在信号结构和保护结构之间的电绝缘结构的堆叠来制造电气设备。 信号结构，绝缘结构和防护结构可以在堆叠中彼此对准。

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