发明申请
US20050017282A1 DRAM BURIED STRAP PROCESS WITH SILICON CARBIDE 审中-公开
具有碳化硅的DRAM烧结带工艺

DRAM BURIED STRAP PROCESS WITH SILICON CARBIDE
摘要:
In the process of forming a trench capacitor, the conductive strap connecting the center electrode of the capacitor with a circuit element in the substrate, such as the pass transistor of a DRAM cell, is separated from the crystalline substrate material by a barrier layer of silicon carbide formed during the process of etching the material within the trench, such as an oxide collar, using a reactive ion etch process with an etchant gas that contains carbon, such as C4F8.
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