Invention Application
- Patent Title: Sealing materials for electrical/electronic appliance
- Patent Title (中): 电气/电子设备密封材料
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Application No.: US10474246Application Date: 2002-02-20
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Publication No.: US20050031858A1Publication Date: 2005-02-10
- Inventor: Katsuhiko Tachibana
- Applicant: Katsuhiko Tachibana
- Priority: JP2001-115071 20010413
- International Application: PCT/JP02/01494 WO 20020220
- Main IPC: B32B5/18
- IPC: B32B5/18 ; B32B27/00 ; C09J7/02 ; C09J167/00 ; C09J175/04 ; C09J201/06 ; H04M1/18 ; H05K5/06 ; B32B7/12
Abstract:
A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulus of 20 N/cm2 or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher.
Information query
