发明申请
US20050045937A1 FENCE-FREE ETCHING OF IRIDIUM BARRIER HAVING A STEEP TAPER ANGLE
失效
具有椎弓根角度的UM。。。。。。。。。。。。。。。。
- 专利标题: FENCE-FREE ETCHING OF IRIDIUM BARRIER HAVING A STEEP TAPER ANGLE
- 专利标题(中): 具有椎弓根角度的UM。。。。。。。。。。。。。。。。
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申请号: US10654376申请日: 2003-09-03
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公开(公告)号: US20050045937A1公开(公告)日: 2005-03-03
- 发明人: Ulrich Egger , Haoren Zhuang , George Stojakovic , Kazuhiro Tomioka
- 申请人: Ulrich Egger , Haoren Zhuang , George Stojakovic , Kazuhiro Tomioka
- 申请人地址: DE Munich JP Tokyo
- 专利权人: Infineon Technologies AG,Kabushiki Kaisha Toshiba
- 当前专利权人: Infineon Technologies AG,Kabushiki Kaisha Toshiba
- 当前专利权人地址: DE Munich JP Tokyo
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/3213 ; H01L21/8246 ; H01L21/00 ; H01L21/8242 ; H01L27/108 ; H01L29/76 ; H01L31/119
摘要:
An Iridium barrier layer is between a contact plug and a bottom electrode of a capacitor. Etching is performed to pattern the bottom electrode and barrier layer using a fluorine-based recipe resulting in the formation of a first fence clinging to the sidewalls. Next the remaining barrier layer is etched using a CO-based recipe. A second fence is formed clinging to and structurally supported by the first fence. At the same time, the CO-based recipe etches away a substantial portion of the first fence to remove the structural support provided to the second fence. The second fence is therefore lifted-off from the sidewalls leaving the sidewalls substantially free of clinging fences. The etched barrier layer has a sidewall transition. The sidewalls have a relatively low taper angle above the sidewall transition and a relatively steep taper angle below the sidewall transition.
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