发明申请
US20050046024A1 Flip-chip interconnect with increased current-carrying capability
审中-公开
倒装芯片互连具有增加的载流能力
- 专利标题： Flip-chip interconnect with increased current-carrying capability
- 专利标题（中）： 倒装芯片互连具有增加的载流能力
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申请号： US10961446申请日： 2004-10-08
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公开(公告)号： US20050046024A1公开(公告)日： 2005-03-03
- 发明人: Pankaj Mithal , William Higdon , Mark Gose , John Dikeman , Frank Stepniak
- 申请人： Pankaj Mithal , William Higdon , Mark Gose , John Dikeman , Frank Stepniak
- 专利权人： DELPHI TECHNOLOGIES, INC.
- 当前专利权人： DELPHI TECHNOLOGIES, INC.
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L23/528 ; H01L21/44
摘要：
A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.
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