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公开(公告)号：US20050046024A1
公开(公告)日：2005-03-03
申请号：US10961446
申请日：2004-10-08
申请人： Pankaj Mithal , William Higdon , Mark Gose , John Dikeman , Frank Stepniak
发明人： Pankaj Mithal , William Higdon , Mark Gose , John Dikeman , Frank Stepniak
IPC分类号： H01L23/485 , H01L23/528 , H01L21/44
CPC分类号： H01L24/02 , H01L23/528 , H01L24/10 , H01L2224/0401 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14
摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.
摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。
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公开(公告)号：US06822327B1
公开(公告)日：2004-11-23
申请号：US10461318
申请日：2003-06-13
IPC分类号： H01L2940
CPC分类号： H01L24/02 , H01L23/528 , H01L24/10 , H01L2224/0401 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14
摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.
摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。
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公开(公告)号：US20130249345A1
公开(公告)日：2013-09-26
申请号：US13427158
申请日：2012-03-22
申请人： Edward L. Kaiser , Peter Bostwick , Pankaj Mithal
发明人： Edward L. Kaiser , Peter Bostwick , Pankaj Mithal
IPC分类号： H02K1/28
CPC分类号： H02K1/2766 , H02K2213/12
摘要： A rotor assembly is provided. The assembly includes a hub and a rotor core having a first rotor lamination positioned at least partially around the hub. The first rotor lamination is at least partially defined by a first segment and a second segment that are configured to connect or interlock. The first segment includes a projection extending from a first body. The projection is configured to engage with a corresponding notch in the second segment in order to connect the first segment to the second segment. At least one first mounting tab extends from the first body and is configured to engage with a corresponding first groove on an outer periphery of the hub in order to connect the first segment to the hub.
摘要翻译： 提供转子组件。 组件包括毂和转子芯，转子芯具有至少部分地围绕轮毂定位的第一转子叠片。 第一转子层压件至少部分地由构造成连接或互锁的第一段和第二段限定。 第一段包括从第一主体延伸的突起。 突起被配置为与第二段中的相应凹口接合，以将第一段连接到第二段。 至少一个第一安装突片从第一主体延伸并且构造成与毂的外周上的对应的第一凹槽接合，以将第一段连接到轮毂。
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公开(公告)号：US06476480B1
公开(公告)日：2002-11-05
申请号：US09612729
申请日：2000-07-10
IPC分类号： H01L2348
CPC分类号： H01L23/051 , H01L24/01 , H01L2924/01079 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： An IC power package particularly suitable for use as a rectifier for an automotive ac generator, as well as an IC packaging method. The power package comprises an electrically-conductive base, a MOSFET die mounted to the base so that the drain region of the MOSFET is electrically connected to the base, an electrically-conductive pin mounted to the die and electrically connected to the source region of the MOSFET, and an electrically-conductive member electrically connected to the gate region of the MOSFET. The conductive member can take several forms, including a second pin or a leadframe mounted to the die, or an annular-shaped member mounted to the base by an electrically-insulative member. In the latter embodiment, the annular-shaped member may be electrically connected to the gate region with a bond wire. The die is preferably encapsulated on the base, so that the base, pin and conductive member provide three connections for a rugged IC package.
摘要翻译： 特别适合用作汽车交流发电机的整流器的IC电源封装以及IC封装方法。 功率封装包括导电基极，安装到基极的MOSFET管芯，使得MOSFET的漏极区域电连接到基极，导电引脚安装到管芯并电连接到管脚的源极区域 MOSFET，以及与MOSFET的栅极区域电连接的导电部件。 导电构件可以采取几种形式，包括安装到模具的第二销或引线框架，或者由电绝缘构件安装到基座的环形构件。 在后一实施例中，环形构件可以用接合线电连接到栅极区域。 模具优选地封装在基座上，使得基座，销和导电构件为坚固的IC封装提供三个连接。
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公开(公告)号：US08482237B2
公开(公告)日：2013-07-09
申请号：US13039347
申请日：2011-03-03
申请人： Daniel J. Berry , Pankaj Mithal , Paul F. Turnbull , Peter J. Savagian , Chia-Chou Yeh , Steven E. Schulz
发明人： Daniel J. Berry , Pankaj Mithal , Paul F. Turnbull , Peter J. Savagian , Chia-Chou Yeh , Steven E. Schulz
IPC分类号： H02H7/08
CPC分类号： B60L3/0061 , B60L2220/12 , B60L2220/14 , B60L2220/18 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/425 , B60L2260/44 , G01K7/42 , G01K2205/00 , Y02T10/642
摘要： A vehicle includes a power source, a motor, and a computing device. The power source provides electrical energy to the motor, and the motor generates rotational motion from the electrical energy received. The computing device is configured to estimate a temperature of the motor in real time based at least in part on a thermal model of the motor. The thermal model includes a plurality of nodes and at least one thermal resistance. Each node represents a region of the motor and each thermal resistance represents a heat transfer path between at least two of the nodes. A method includes solving one or more energy balance equations to determine a temperature change at each node and estimating the temperature of the motor in real time based at least in part on the temperature change at each node and at least one of the thermal resistances in the thermal model.
摘要翻译： 车辆包括电源，电动机和计算装置。 电源向电动机提供电能，并且电动机从接收的电能产生旋转运动。 计算设备被配置为至少部分地基于电动机的热模型实时地估计电动机的温度。 热模型包括多个节点和至少一个热阻。 每个节点表示电动机的区域，每个热阻表示至少两个节点之间的热传递路径。 一种方法包括解决一个或多个能量平衡方程以确定每个节点处的温度变化并且至少部分地基于每个节点处的温度变化以及至少一个热电阻来实时估计电动机的温度 热模型。
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公开(公告)号：US07047827B1
公开(公告)日：2006-05-23
申请号：US11119981
申请日：2005-05-02
申请人： Pankaj Mithal
发明人： Pankaj Mithal
摘要： A portable digital scale is foldable for ease of storage and transport. The scale includes a fluid-filled elastomeric bladder and electronic module disposed in a hard-sided case that is opened in use and folded to encase the bladder and electronic module during transport and storage. The electronic module includes a pressure sensor for detecting the fluid pressure in the bladder as a measure of the user's weight, and a user interface and digital display for displaying the weight and/or other parameters requested by the user. Preferably, the electronic module includes a memory device capable of storing multiple weight measurements and a data port for down-loading stored weight data to a personal computer or PDA for tracking weight variation of one or more users over time.
摘要翻译： 便携式数字秤可折叠，便于存储和运输。 标尺包括流体填充的弹性体囊和设置在使用中打开并在运输和储存期间折叠以包住膀胱和电子模块的硬质面的壳体中的电子模块。 电子模块包括用于检测膀胱中的流体压力的压力传感器，作为用户重量的度量，以及用于显示用户请求的重量和/或其他参数的用户界面和数字显示器。 优选地，电子模块包括能够存储多个权重测量的存储器设备和用于将存储的权重数据下载到个人计算机或PDA的数据端口，用于跟踪一个或多个用户随时间的权重变化。
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公开(公告)号：US20120226483A1
公开(公告)日：2012-09-06
申请号：US13039347
申请日：2011-03-03
申请人： Daniel J. Berry , Pankaj Mithal , Paul F. Turnbull , Peter J. Savagian , Chia-Chou Yeh , Steven E. Schulz
发明人： Daniel J. Berry , Pankaj Mithal , Paul F. Turnbull , Peter J. Savagian , Chia-Chou Yeh , Steven E. Schulz
CPC分类号： B60L3/0061 , B60L2220/12 , B60L2220/14 , B60L2220/18 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/425 , B60L2260/44 , G01K7/42 , G01K2205/00 , Y02T10/642
摘要： A vehicle includes a power source, a motor, and a computing device. The power source provides electrical energy to the motor, and the motor generates rotational motion from the electrical energy received. The computing device is configured to estimate a temperature of the motor in real time based at least in part on a thermal model of the motor. The thermal model includes a plurality of nodes and at least one thermal resistance. Each node represents a region of the motor and each thermal resistance represents a heat transfer path between at least two of the nodes. A method includes solving one or more energy balance equations to determine a temperature change at each node and estimating the temperature of the motor in real time based at least in part on the temperature change at each node and at least one of the thermal resistances in the thermal model.
摘要翻译： 车辆包括电源，电动机和计算装置。 电源向电动机提供电能，并且电动机从接收的电能产生旋转运动。 计算设备被配置为至少部分地基于电动机的热模型实时地估计电动机的温度。 热模型包括多个节点和至少一个热阻。 每个节点表示电动机的区域，每个热阻表示至少两个节点之间的热传递路径。 一种方法包括解决一个或多个能量平衡方程以确定每个节点处的温度变化并且至少部分地基于每个节点处的温度变化以及至少一个热电阻来实时估计电动机的温度 热模型。
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公开(公告)号：US20050104190A1
公开(公告)日：2005-05-19
申请号：US10971813
申请日：2004-10-22
申请人： Pankaj Mithal , Bradley Knigga , Steven Middleton
发明人： Pankaj Mithal , Bradley Knigga , Steven Middleton
IPC分类号： H01L23/16 , H01L23/495 , H01L23/498 , H01L23/48
CPC分类号： H01L23/16 , H01L23/49575 , H01L23/49844 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.
摘要翻译： 一种电子模块，包括多个导电引线，导电基板，第一集成电路（IC）管芯，至少一个材料块和非导电二次模具。 至少一个材料块用于更紧密地匹配电子模块的部件之间的热膨胀系数（CTE）差异。
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公开(公告)号：US06809423B1
公开(公告)日：2004-10-26
申请号：US10717245
申请日：2003-11-19
IPC分类号： H01L2348
CPC分类号： H01L23/16 , H01L23/49575 , H01L23/49844 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.
摘要翻译： 一种电子模块，包括多个导电引线，导电基板，第一集成电路（IC）管芯，至少一个材料块和非导电二次模具。 至少一个材料块用于更紧密地匹配电子模块的部件之间的热膨胀系数（CTE）差异。
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