公开(公告)号：US20050046024A1

公开(公告)日：2005-03-03

申请号：US10961446

申请日：2004-10-08

申请人： Pankaj Mithal ,  William Higdon ,  Mark Gose ,  John Dikeman ,  Frank Stepniak

发明人： Pankaj Mithal ,  William Higdon ,  Mark Gose ,  John Dikeman ,  Frank Stepniak

IPC分类号： H01L23/485 ,  H01L23/528 ,  H01L21/44

CPC分类号： H01L24/02 ,  H01L23/528 ,  H01L24/10 ,  H01L2224/0401 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14

摘要： A metal runner that improves the current-carrying capability of solder bumps used to electrically connect a surface-mount circuit device to a substrate. The runner comprises at least one leg portion and a pad portion, with the pad portion having a continuous region and a plurality of separate electrical paths leading to and from the continuous region. The electrical paths are delineated in the pad portion by nonconductive regions defined in the pad portion, with at least some of the nonconductive regions extending into the leg portion. The multiple electrical paths split the current flow to and from the solder bump, distributing the current around the perimeter of the solder bump in a manner that reduces current density in regions of the solder bump where electromigration is most likely.

摘要翻译： 金属流道，其提高用于将表面贴装电路器件电连接到衬底的焊料凸块的载流能力。 流道包括至少一个支腿部分和垫部分，其中该焊盘部分具有连续区域和连续区域的多个分开的电路径。 在焊盘部分中通过限定在焊盘部分中的非导电区域描绘电路径，其中至少一些非导电区域延伸到腿部。 多个电路径将电流流向和从焊料凸块分开，以在减少电子迁移最有可能的焊料凸块区域中的电流密度的方式将电流分布在焊料凸块的周边周围。

公开(公告)号：US20060208340A1

公开(公告)日：2006-09-21

申请号：US11080274

申请日：2005-03-15

申请人： Jack Glenn ,  Troy Clear ,  Mark Gose ,  John Dikeman

发明人： Jack Glenn ,  Troy Clear ,  Mark Gose ,  John Dikeman

IPC分类号： H01L29/861

CPC分类号： H01L29/0638 ,  H01L24/05 ,  H01L27/0255 ,  H01L27/0814 ,  H01L29/866 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/48463 ,  H01L2924/12035 ,  H01L2924/13091 ,  H01L2924/00

摘要： A protection device for handling energy transients includes a plurality of basic unit Zener diodes connected in series to achieve a desired breakdown voltage. Each of the basic unit Zener diodes is formed in a first-type substrate. Each of the basic unit Zener diodes comprises a second-type well formed in the substrate, a second-type Zener region formed in the second-type well and a first-type+ region formed over the second-type Zener region between a first and second second-type+ region.

摘要翻译： 用于处理能量瞬变的保护装置包括串联连接的多个基本单元齐纳二极管以实现期望的击穿电压。 基本单位齐纳二极管中的每一个形成在第一类型的基板中。 每个基本单位齐纳二极管包括在衬底中形成的第二类阱，形成在第二类型阱中的第二类型齐纳一区域和形成在第二类型齐纳二极区之间的第一类型+区域 第二类+区域。

公开(公告)号：US20070239419A1

公开(公告)日：2007-10-11

申请号：US11399893

申请日：2006-04-07

申请人： Fereydoon Dadkhah ,  John Dikeman ,  Gregory Hutchinson

发明人： Fereydoon Dadkhah ,  John Dikeman ,  Gregory Hutchinson

IPC分类号： G06F17/50

CPC分类号： G06T17/20 ,  G06F17/5018 ,  G06F2217/80

摘要： The present invention includes a method for performing a thermal analysis, including the steps of determining size and placement of each of a plurality of drivers on an integrated circuit device. The determined size and placement of each driver is stored as layout data and the layout data is converted into input for a finite element analysis program. The input is applied to the finite element analysis program, and the finite element analysis program is used to construct a finite element mesh of the integrated circuit device from the input. Additionally, material properties are assigned to the finite element mesh, and a thermal analysis is performed of the finite element mesh to generate data in a thermal analysis report.

摘要翻译： 本发明包括一种用于执行热分析的方法，包括以下步骤：确定集成电路装置上的多个驱动器中的每一个的大小和布置。 确定每个驱动程序的大小和位置作为布局数据存储，并将布局数据转换为有限元分析程序的输入。 输入应用于有限元分析程序，有限元分析程序用于从输入构建集成电路器件的有限元网格。 另外，材料属性被分配给有限元网格，并且在有限元网格中执行热分析以在热分析报告中生成数据。