Invention Application
US20050067663A1 Oxide-nitride stack gate dielectric 有权
氧化氮化物堆叠栅极电介质

Oxide-nitride stack gate dielectric
Abstract:
A method of making a semiconductor structure comprises forming an oxide layer on a substrate; forming a silicon nitride layer on the oxide layer; annealing the layers in NO; and annealing the layers in ammonia. The equivalent oxide thickness of the oxide layer and the silicon nitride layer together is at most 25 Angstroms.
Public/Granted literature
Information query
Patent Agency Ranking
0/0