Invention Application
US20050079803A1 Chemical-mechanical planarization composition having PVNO and associated method for use
审中-公开
具有PVNO的化学机械平面化组合物及其相关使用方法
- Patent Title: Chemical-mechanical planarization composition having PVNO and associated method for use
- Patent Title (中): 具有PVNO的化学机械平面化组合物及其相关使用方法
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Application No.: US10683231Application Date: 2003-10-10
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Publication No.: US20050079803A1Publication Date: 2005-04-14
- Inventor: Junaid Siddiqui , Bin Hu
- Applicant: Junaid Siddiqui , Bin Hu
- Main IPC: B24B37/00
- IPC: B24B37/00 ; B24B1/00 ; C09G1/02 ; C09K3/14 ; H01L21/304 ; H01L21/321

Abstract:
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an abrasive and a polyvinylpyridine-N-oxide polymer. The composition possesses high selectivities for metal and barrier material removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).
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