发明申请
- 专利标题： Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
- 专利标题（中）： 电镀铜液和制造半导体集成电路器件的工艺
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申请号： US10996382申请日： 2004-11-26
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公开(公告)号： US20050087447A1公开(公告)日： 2005-04-28
- 发明人: Toshio Haba , Takeyuki Itabashi , Haruo Akahoshi , Shinichi Fukada
- 申请人： Toshio Haba , Takeyuki Itabashi , Haruo Akahoshi , Shinichi Fukada
- 优先权： JP2000-349060 20001116
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C25D7/12 ; H01L21/288 ; H01L21/768 ; H01L23/522 ; H05K3/42
摘要：
An object of the present invention is to improve the reliability and the yield of production of semiconductor integrated circuit devices by filling copper in the inside of features having a high aspect ratio for forming multi-layer interconnections composed of a plurality of interconnection layers which are connected to one another and to a copper electroplating bath suitable therefor. In the present invention, when the features are filled with copper, the use of a copper electroplating bath with an addition of cyanine dyes, for example, indolium compounds allows the copper plating to proceed preferentially from the bottoms of the features.
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