发明申请
US20050087822A1 Nitrided ultrathin gate dielectrics 失效
氮化超薄栅极电介质

Nitrided ultrathin gate dielectrics
摘要:
A method for forming a gate dielectric for an integrated circuit device. In an exemplary embodiment of the invention, the method includes forming an initial oxynitride layer upon a substrate material, the oxynitride layer having an initial physical thickness. The initial oxynitride layer is then subjected to a plasma nitridation, the plasma nitridation resulting in final oxynitride layer having a final physical thickness.
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