发明申请
- 专利标题： Manufacturing method of semiconductor device and semiconductor device
- 专利标题（中）： 半导体器件和半导体器件的制造方法
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申请号： US10961041申请日： 2004-10-12
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公开(公告)号： US20050101052A1公开(公告)日： 2005-05-12
- 发明人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
- 申请人： Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
- 优先权： JP2003-367435 20031028
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/56 ; H05K1/03 ; H05K3/00 ; H05K3/28
摘要：
In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.