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公开(公告)号:US07223636B2
公开(公告)日:2007-05-29
申请号:US10961041
申请日:2004-10-12
申请人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
发明人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
IPC分类号: H01L21/44
CPC分类号: H05K3/0052 , H01L21/481 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2203/302 , H01L2924/00012
摘要: In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
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2.
公开(公告)号:US20070105283A1
公开(公告)日:2007-05-10
申请号:US11647162
申请日:2006-12-29
申请人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
发明人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
IPC分类号: H01L21/00
CPC分类号: H05K3/0052 , H01L21/481 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2203/302 , H01L2924/00012
摘要: In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
摘要翻译: 在根据本发明的分割方法中,由陶瓷制成的布线基板由夹持器的下夹爪推动(上摆),并且从输送槽突出的一些突出的布线板部分被压靠在支撑件 身体在弯曲应力下进行第一次分裂。 此后,向上定位的夹持器向下可旋转地摆动(下摆动),以允许上夹爪向下按压突出的布线板部分,从而在第一分割部分再次进行相反分割,作为第二分割。 由于第二分割允许张力作用在剩余的薄的未分割树脂部分上,所以未分割树脂部分被撕开。 因此,完美的划分得以实现。 通过单行分割和单独分割来进行分数化,从而形成每个半导体器件。
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3.
公开(公告)号:US20050101052A1
公开(公告)日:2005-05-12
申请号:US10961041
申请日:2004-10-12
申请人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
发明人: Yoshihiko Kobayashi , Susumu Sato , Koki Tanimoto , Tomio Yamada , Hirokazu Nakajima , Tomoaki Kudaishi , Yoshinori Shiokawa , Toshiharu Niitsu , Tsutomu Ida
CPC分类号: H05K3/0052 , H01L21/481 , H01L2224/48227 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2203/302 , H01L2924/00012
摘要: In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
摘要翻译: 在根据本发明的分割方法中,由陶瓷制成的布线基板由夹持器的下夹爪推动(上摆),并且从输送槽突出的一些突出的布线板部分被压靠在支撑件 身体在弯曲应力下进行第一次分裂。 此后,向上定位的夹持器向下可旋转地摆动(下摆动),以允许上夹爪压下突出的布线板部分,从而在第一分割部分再次进行相反分割,作为第二分割。 由于第二分割允许张力作用在剩余的薄的未分割树脂部分上,所以未分割树脂部分被撕开。 因此,完美的划分得以实现。 通过单行分割和单独分割来进行分数化,从而形成每个半导体器件。
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