公开(公告)号：US07223636B2

公开(公告)日：2007-05-29

申请号：US10961041

申请日：2004-10-12

申请人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

发明人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

IPC分类号： H01L21/44

CPC分类号： H05K3/0052 ,  H01L21/481 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/302 ,  H01L2924/00012

摘要： In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

公开(公告)号：US20050101052A1

公开(公告)日：2005-05-12

申请号：US10961041

申请日：2004-10-12

申请人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

发明人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

IPC分类号： H01L23/28 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28

CPC分类号： H05K3/0052 ,  H01L21/481 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/302 ,  H01L2924/00012

摘要： In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

摘要翻译： 在根据本发明的分割方法中，由陶瓷制成的布线基板由夹持器的下夹爪推动（上摆），并且从输送槽突出的一些突出的布线板部分被压靠在支撑件 身体在弯曲应力下进行第一次分裂。 此后，向上定位的夹持器向下可旋转地摆动（下摆动），以允许上夹爪压下突出的布线板部分，从而在第一分割部分再次进行相反分割，作为第二分割。 由于第二分割允许张力作用在剩余的薄的未分割树脂部分上，所以未分割树脂部分被撕开。 因此，完美的划分得以实现。 通过单行分割和单独分割来进行分数化，从而形成每个半导体器件。

公开(公告)号：US20070105283A1

公开(公告)日：2007-05-10

申请号：US11647162

申请日：2006-12-29

申请人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

发明人： Yoshihiko Kobayashi ,  Susumu Sato ,  Koki Tanimoto ,  Tomio Yamada ,  Hirokazu Nakajima ,  Tomoaki Kudaishi ,  Yoshinori Shiokawa ,  Toshiharu Niitsu ,  Tsutomu Ida

IPC分类号： H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/481 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/302 ,  H01L2924/00012

摘要： In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

摘要翻译： 在根据本发明的分割方法中，由陶瓷制成的布线基板由夹持器的下夹爪推动（上摆），并且从输送槽突出的一些突出的布线板部分被压靠在支撑件 身体在弯曲应力下进行第一次分裂。 此后，向上定位的夹持器向下可旋转地摆动（下摆动），以允许上夹爪向下按压突出的布线板部分，从而在第一分割部分再次进行相反分割，作为第二分割。 由于第二分割允许张力作用在剩余的薄的未分割树脂部分上，所以未分割树脂部分被撕开。 因此，完美的划分得以实现。 通过单行分割和单独分割来进行分数化，从而形成每个半导体器件。

公开(公告)号：US06989587B2

公开(公告)日：2006-01-24

申请号：US10730119

申请日：2003-12-09

申请人： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

发明人： Mamoru Ito ,  Akira Muto ,  Tomio Yamada ,  Tsuneo Endoh ,  Satoru Konishi ,  Kazuaki Uehara ,  Tsutomu Ida ,  Koji Odaira ,  Hirokazu Nakajima

IPC分类号： H91L23/02

CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

摘要翻译： 提供了具有增强的可靠性的半导体器件，其具有安装多个半导体芯片的散热器，与半导体芯片电连接的多个内部引线，用于树脂模制多个半导体芯片和多个内部引线的成型体， 用于提供半导体芯片的各个电极和对应于其的内部引线之间的电连接的多根电线，以及连接到内部引线并暴露在模制体外部的宽的外部引线。 在位于模制体外部的外引线的各个部分中形成多个狭缝，以在外引线被抽取的方向上纵向延伸。 这实现了在安装MOSFET之后通过热应力等放置在外引线上的引线应力的降低，从而提高了MOSFET的可靠性。

公开(公告)号：US07468294B2

公开(公告)日：2008-12-23

申请号：US10985049

申请日：2004-11-10

申请人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

发明人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40

CPC分类号： H05K3/284 ,  H01L23/29 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

摘要翻译： 一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部 通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分 用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

公开(公告)号：US06710263B2

公开(公告)日：2004-03-23

申请号：US09790978

申请日：2001-02-23

申请人： Toshiyuki Kobayashi ,  Yasutoshi Kurihara ,  Takumi Ueno ,  Nobuyoshi Maejima ,  Hirokazu Nakajima ,  Tomio Yamada ,  Tsuneo Endoh

发明人： Toshiyuki Kobayashi ,  Yasutoshi Kurihara ,  Takumi Ueno ,  Nobuyoshi Maejima ,  Hirokazu Nakajima ,  Tomio Yamada ,  Tsuneo Endoh

IPC分类号： H05K116

CPC分类号： H01L24/97 ,  H01L23/49894 ,  H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/175 ,  H01L2224/92247 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2075 ,  H01L2924/2076 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2924/01049

摘要： In a semiconductor device, the likely occurrence of cracking of a ceramic substrate, and the consequential disconnection of internal layer wiring, due to thermal changes suffered when the semiconductor device is mounted on external wiring boards having different thermal expansion is prevented. The semiconductor device has a ceramic substrate, a wiring pattern formed on a first principal plane and having mounted semiconductor components, an external electrode portion formed on a second principal plane and connected to an external circuit, internal layer wiring formed inside said ceramic substrate to electrically connect said wiring pattern and said external electrode portion via through-hole wiring, and semiconductor components and a resin layer covering said semiconductor components, wherein the internal layer wiring is formed internally with respect to the side of said ceramic substrate with a clearance of at least 0.05 mm.

摘要翻译： 在半导体装置中，防止了当将半导体器件安装在具有不同热膨胀的外部布线板上时，由于热变化而导致陶瓷基板的破裂的可能发生，以及由此导致的内层布线的断开。 半导体器件具有陶瓷基板，形成在第一主平面上并具有安装的半导体部件的布线图案，形成在第二主平面上并连接到外部电路的外部电极部分，形成在所述陶瓷基板内部的内部层布线， 通过通孔布线连接所述布线图案和所述外部电极部分，以及半导体部件和覆盖所述半导体部件的树脂层，其中内层布线相对于所述陶瓷基板的侧面至少形成有至少间隙 0.05毫米。

公开(公告)号：US06831360B2

公开(公告)日：2004-12-14

申请号：US10021173

申请日：2001-12-19

申请人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

发明人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

IPC分类号： H01L2334

CPC分类号： H05K3/284 ,  H01L23/29 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

摘要翻译： 一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部 通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分 用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

公开(公告)号：US20050082683A1

公开(公告)日：2005-04-21

申请号：US10985049

申请日：2004-11-10

申请人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

发明人： Masashi Yamaura ,  Hirokazu Nakajima ,  Nobuyoshi Maejima ,  Mikio Negishi ,  Tomio Yamada ,  Tomomichi Koizumi ,  Tsuneo Endoh

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00 ,  H05K3/28 ,  H01L23/48

CPC分类号： H05K3/284 ,  H01L23/29 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

摘要翻译： 一种半导体器件，包括在主表面上形成有多个焊盘的半导体芯片，各自形成有两端的连接端子的芯片部件，安装有半导体芯片和芯片部件的模块基板，用于连接芯片的焊接连接部 通过焊接来模块基板的部件和基板端子，用于连接半导体芯片的焊盘的金线和模块基板的相应的基板端子，以及由诸如绝缘硅树脂的低弹性树脂形成的密封部分 用于覆盖半导体芯片，芯片部件，焊料连接部分和金线的弹性环氧树脂，其通过再熔化防止焊料连接部分中的焊料流出，从而防止短路。

公开(公告)号：US07978037B2

公开(公告)日：2011-07-12

申请号：US12368717

申请日：2009-02-10

申请人： Tomio Yamada ,  Tatsumi Ide ,  Yoshinori Ota

发明人： Tomio Yamada ,  Tatsumi Ide ,  Yoshinori Ota

IPC分类号： H01H9/00

CPC分类号： H01H36/008 ,  H01H1/26 ,  H01H36/0046

摘要： A movable contact positioned in a sealed case is moved together with a movable contact spring provided with an armature by a magnetic shunt body which is moved outside the sealed case. The movement of the movable contact (movement of the movable contact spring) due to the movement of the magnetic shunt body is based on the change of the magnetically attracting force of a magnet with respect to the armature through a pair of yokes. The movable contact spring is provided with a bent portion which is bent in spaced-apart relation to the armature, the bent portion being provided between a fulcrum portion at a time when the movable contact spring moves and a portion where the armature is provided.

摘要翻译： 定位在密封壳体中的可动触头与设置有电枢的可动接触弹簧一起通过磁性分流器主体移动，所述磁分路器移动到密封壳体的外部。 由于磁分路体的运动，可动触点的移动（活动触点弹簧的移动）是基于磁体相对于电枢通过一对磁轭的磁力吸引力的变化。 可动接触弹簧设置有弯曲部分，该弯曲部分与电枢间隔开地弯曲，弯曲部分设置在可动接触弹簧移动时的支点部分和设置电枢的部分之间。

公开(公告)号：US07902656B2

公开(公告)日：2011-03-08

申请号：US12769207

申请日：2010-04-28

申请人： Shinji Moriyama ,  Tomio Yamada

发明人： Shinji Moriyama ,  Tomio Yamada

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/04 ,  H01L23/053 ,  H01L23/12 ,  H01L29/40 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119 ,  H01L27/10 ,  H01L29/73

CPC分类号： H01L23/13 ,  H01L23/10 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H03G3/3042 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.

摘要翻译： 具有高安装可靠性的混合集成电路装置包括：模块基板，其是陶瓷布线基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的后表面上的多个电极端子 模块基板和固定到模块基板以覆盖模块基板的主表面的盖。 电极端子包括沿着模块基板的边缘排列的多个电极端子和位于内部的电源电压端子。 沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。 连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。