发明申请
- 专利标题： Electrolytic plating method and device for a wiring board
- 专利标题（中）： 电镀方法及布线板装置
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申请号： US10896488申请日： 2004-07-22
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公开(公告)号： US20050121314A1公开(公告)日： 2005-06-09
- 发明人: Toshiki Inoue , Kyoko Kumagai
- 申请人： Toshiki Inoue , Kyoko Kumagai
- 专利权人： Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- 当前专利权人： Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- 优先权： JP2000-079709 20000322
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C25D5/18 ; C25D7/00 ; C25D21/14 ; H05K3/18 ; H05K3/42 ; H05K3/46 ; C25D17/00
摘要：
A plating bath which accommodates an insoluble node and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode Is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
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