Invention Application
- Patent Title: Electrolytic plating method and device for a wiring board
- Patent Title (中): 电镀方法及布线板装置
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Application No.: US10896488Application Date: 2004-07-22
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Publication No.: US20050121314A1Publication Date: 2005-06-09
- Inventor: Toshiki Inoue , Kyoko Kumagai
- Applicant: Toshiki Inoue , Kyoko Kumagai
- Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- Current Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
- Priority: JP2000-079709 20000322
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/18 ; C25D7/00 ; C25D21/14 ; H05K3/18 ; H05K3/42 ; H05K3/46 ; C25D17/00
Abstract:
A plating bath which accommodates an insoluble node and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode Is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
Information query
