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发明申请
US20050194348A1 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 审中-公开
电介质材料和/或使用电介质基片的电化学制造方法

Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
摘要：
Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates.
摘要（中）：

各种实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种介电材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。 在其它实施例中，在电介质基底上形成电化学制造的结构。

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