发明申请
- 专利标题： Conductive silver paste and conductive film formed using the same
- 专利标题（中）： 导电银浆和使用其形成的导电膜
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申请号： US11068829申请日： 2005-03-02
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公开(公告)号： US20050194577A1公开(公告)日： 2005-09-08
- 发明人: Takashi Kasuga , Kohei Shimoda , Masahiro Yamakawa
- 申请人： Takashi Kasuga , Kohei Shimoda , Masahiro Yamakawa
- 专利权人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 优先权： JP2004-059722 20040303
- 主分类号： C08K7/06
- IPC分类号： C08K7/06 ; C08K7/18 ; C08K9/04 ; C08K13/06 ; H01B1/00 ; H01B1/22 ; H05K1/09 ; H01C1/00
摘要：
A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 μm, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 μm, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.
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